T. Sudô
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Measurements
- Electrostatic Discharge in Electronics
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- Advanced Antenna and Metasurface Technologies
Papers in
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- 3D IC and TSV technologies 19
- Electronic Packaging and Soldering Technologies 16
- Electromagnetic Compatibility and Noise Suppression 16
- Low-power high-performance VLSI design 5
- Electromagnetic Compatibility and Measurements 5
- Electrostatic Discharge in Electronics 4
- Integrated Circuits and Semiconductor Failure Analysis 4
- VLSI and FPGA Design Techniques 3
- Co-authors
- Hideki Sasaki (1 shared paper)James L. Drewniak (1 shared paper)Norio Masuda (1 shared paper)Kazuhisa Tomita (1 shared paper)Masakuni Matsuoka (1 shared paper)Y. Hiruta (7 shared papers)T. Sakae (1 shared paper)Ken Nakano (4 shared papers)
- Journals
- The Journal of Urology (2 papers)Nature (2 papers)IEEE Transactions on Advanced Packaging (1 paper)Journal of Lightwave Technology (1 paper)Geochimica et Cosmochimica Acta (1 paper)
- Partner nations
- JapanSouth KoreaUnited States
In The Last Decade
T. Sudô
41 papers receiving 366 citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 303
- Aerospace Engineering 67
- Hardware and Architecture 18
- Biomaterials 34
- Electronic, Optical and Magnetic Materials 40
Countries citing papers authored by T. Sudô
This map shows the geographic impact of T. Sudô's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Sudô with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Sudô more than expected).
Fields of papers citing papers by T. Sudô
This network shows the impact of papers produced by T. Sudô. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Sudô. The network helps show where T. Sudô may publish in the future.
Co-authors
The 25 scholars most cited alongside T. Sudô, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 155 | |
| 2 | 1994 | 28 | |
| 3 | The crystal structure of synthetic calcium phosphate-sulfate hydrate, Ca<2) HPO<4) SO<4) .4H<2) O, and its relation to brushite and gypsum | 1978 | 21 |
| 4 | 1968 | 17 | |
| 5 | 1959 | 16 | |
| 6 | 2006 | 15 | |
| 7 | 2003 | 14 | |
| 8 | 1983 | 13 | |
| 9 | 2003 | 10 | |
| 10 | 1997 | 9 | |
| 11 | 2002 | 8 | |
| 12 | 1993 | 8 | |
| 13 | 1995 | 7 | |
| 14 | 2002 | 5 | |
| 15 | 2011 | 5 | |
| 16 | 1990 | 5 | |
| 17 | 2002 | 5 | |
| 18 | 2002 | 5 | |
| 19 | Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor - | 1994 | 4 |
| 20 | 1972 | 4 |
About T. Sudô
T. Sudô is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Industrial and Manufacturing Engineering, Hardware and Architecture and Aerospace Engineering, having authored 44 papers that have together received 399 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (19 papers), Electronic Packaging and Soldering Technologies (16 papers), Electromagnetic Compatibility and Noise Suppression (16 papers), Low-power high-performance VLSI design (5 papers), Electromagnetic Compatibility and Measurements (5 papers), Electrostatic Discharge in Electronics (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and VLSI and FPGA Design Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (303 citations), Aerospace Engineering (67 citations), Hardware and Architecture (18 citations), Biomaterials (34 citations) and Electronic, Optical and Magnetic Materials (40 citations). T. Sudô has collaborated with scholars based in Japan, South Korea and United States. Frequent co-authors include Hideki Sasaki, James L. Drewniak, Norio Masuda, Kazuhisa Tomita, Masakuni Matsuoka, Y. Hiruta, T. Sakae, Ken Nakano, Koji Matsumoto and Koichi Ito. Their work appears in journals such as The Journal of Urology, Nature, IEEE Transactions on Advanced Packaging, Journal of Lightwave Technology and Geochimica et Cosmochimica Acta.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.