Robert C. Pack
Impact in
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
- Building and Construction top 10%
- Innovations in Concrete and Construction Materials
Papers in
-
- Integrated Circuits and Semiconductor Failure Analysis 4
- Advancements in Photolithography Techniques 4
-
- Advanced Surface Polishing Techniques 3
- Advanced Sensor and Energy Harvesting Materials 2
- Bone Tissue Engineering Materials 2
- Co-authors
- Brett G. Compton (7 shared papers)Nadim S. Hmeidat (3 shared papers)Samantha J. Talley (1 shared paper)Robert B. Moore (1 shared paper)Maximilian Heres (1 shared paper)Joshua Sangoro (1 shared paper)M. Paranthaman (1 shared paper)Orlando Rios (1 shared paper)
- Journals
- Additive manufacturing (2 papers)Advanced Materials Technologies (1 paper)Materials and Manufacturing Processes (1 paper)Advanced Engineering Materials (1 paper)IEEE Transactions on Electron Devices (1 paper)
- Partner nations
- United StatesSingaporeUnited Kingdom
In The Last Decade
Robert C. Pack
14 papers receiving 342 citations
Peers
Comparison fields: 5 of 57
- Automotive Engineering 212
- Building and Construction 69
- Industrial and Manufacturing Engineering 38
- Mechanical Engineering 132
- General Materials Science 9
Countries citing papers authored by Robert C. Pack
This map shows the geographic impact of Robert C. Pack's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Robert C. Pack with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Robert C. Pack more than expected).
Fields of papers citing papers by Robert C. Pack
This network shows the impact of papers produced by Robert C. Pack. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Robert C. Pack. The network helps show where Robert C. Pack may publish in the future.
Co-authors
The 23 scholars most cited alongside Robert C. Pack, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 90 | |
| 2 | 2016 | 89 | |
| 3 | 2017 | 75 | |
| 4 | 2020 | 23 | |
| 5 | 2020 | 19 | |
| 6 | 1980 | 15 | |
| 7 | 2020 | 13 | |
| 8 | 2003 | 8 | |
| 9 | 2019 | 7 | |
| 10 | 1993 | 4 | |
| 11 | 2002 | 2 | |
| 12 | 2014 | 2 | |
| 13 | 2005 | 2 | |
| 14 | 1982 | 1 | |
| 15 | 2025 | 0 |
About Robert C. Pack
Robert C. Pack is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Automotive Engineering, Mechanical Engineering and Mechanics of Materials, having authored 15 papers that have together received 350 indexed citations. Recurring topics across this work include Additive Manufacturing and 3D Printing Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Advancements in Photolithography Techniques (4 papers), Advanced Surface Polishing Techniques (3 papers), Advanced Sensor and Energy Harvesting Materials (2 papers), Bone Tissue Engineering Materials (2 papers), Advanced Welding Techniques Analysis (1 paper) and Innovations in Concrete and Construction Materials (1 paper). The work is most often cited by research in Automotive Engineering (212 citations), Building and Construction (69 citations), Industrial and Manufacturing Engineering (38 citations), Mechanical Engineering (132 citations) and General Materials Science (9 citations). Robert C. Pack has collaborated with scholars based in United States, Singapore and United Kingdom. Frequent co-authors include Brett G. Compton, Nadim S. Hmeidat, Samantha J. Talley, Robert B. Moore, Maximilian Heres, Joshua Sangoro, M. Paranthaman, Orlando Rios, Chad Duty and James W. Kemp. Their work appears in journals such as Additive manufacturing, Advanced Materials Technologies, Materials and Manufacturing Processes, Advanced Engineering Materials and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.