Patrick William DeHaven
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Perovskite Materials and Applications
- Electronic Packaging and Soldering Technologies
Papers in
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- Copper Interconnects and Reliability 13
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- Electronic Packaging and Soldering Technologies 11
- Semiconductor materials and devices 11
- 3D IC and TSV technologies 5
- Advancements in Semiconductor Devices and Circuit Design 4
- Electrodeposition and Electroless Coatings 4
- Co-authors
- Ronald A. Lovett (1 shared paper)Frank P. Buff (1 shared paper)Virgil L. Goedken (2 shared papers)David R. Medeiros (1 shared paper)David B. Mitzi (1 shared paper)Kenneth P. Rodbell (3 shared papers)Marvin C. Weiss (1 shared paper)Philip M. Warner (2 shared papers)
- Journals
- Journal of the American Chemical Society (2 papers)The Journal of Chemical Physics (1 paper)Journal of The Electrochemical Society (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)Inorganic Chemistry (1 paper)
- Partner nations
- United StatesGermanySwitzerland
In The Last Decade
Patrick William DeHaven
32 papers receiving 402 citations
Peers
Comparison fields: 5 of 53
- Electronic, Optical and Magnetic Materials 96
- Electrical and Electronic Engineering 216
- Statistical and Nonlinear Physics 43
- Materials Chemistry 132
- Biomedical Engineering 123
Countries citing papers authored by Patrick William DeHaven
This map shows the geographic impact of Patrick William DeHaven's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick William DeHaven with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick William DeHaven more than expected).
Fields of papers citing papers by Patrick William DeHaven
This network shows the impact of papers produced by Patrick William DeHaven. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick William DeHaven. The network helps show where Patrick William DeHaven may publish in the future.
Co-authors
The 25 scholars most cited alongside Patrick William DeHaven, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 35 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1973 | 103 | |
| 2 | 2002 | 60 | |
| 3 | 1979 | 29 | |
| 4 | 1978 | 22 | |
| 5 | 1998 | 20 | |
| 6 | 1995 | 19 | |
| 7 | 1995 | 19 | |
| 8 | 2013 | 18 | |
| 9 | 1977 | 17 | |
| 10 | 2012 | 16 | |
| 11 | 1991 | 15 | |
| 12 | 1984 | 14 | |
| 13 | 2014 | 14 | |
| 14 | 1996 | 9 | |
| 15 | 2011 | 7 | |
| 16 | 2011 | 7 | |
| 17 | 2003 | 5 | |
| 18 | 1994 | 4 | |
| 19 | 2010 | 4 | |
| 20 | 1984 | 4 |
About Patrick William DeHaven
Patrick William DeHaven is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, General Materials Science, Mechanics of Materials and Materials Chemistry, having authored 35 papers that have together received 435 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Electronic Packaging and Soldering Technologies (11 papers), Semiconductor materials and devices (11 papers), Metal and Thin Film Mechanics (6 papers), 3D IC and TSV technologies (5 papers), Advancements in Semiconductor Devices and Circuit Design (4 papers), Semiconductor materials and interfaces (4 papers) and Electrodeposition and Electroless Coatings (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (96 citations), Electrical and Electronic Engineering (216 citations), Statistical and Nonlinear Physics (43 citations), Materials Chemistry (132 citations) and Biomedical Engineering (123 citations). Patrick William DeHaven has collaborated with scholars based in United States, Germany and Switzerland. Frequent co-authors include Ronald A. Lovett, Frank P. Buff, Virgil L. Goedken, David R. Medeiros, David B. Mitzi, Kenneth P. Rodbell, Marvin C. Weiss, Philip M. Warner, Robert A. Jacobson and L. A. Clevenger. Their work appears in journals such as Journal of the American Chemical Society, The Journal of Chemical Physics, Journal of The Electrochemical Society, Journal of materials research/Pratt's guide to venture capital sources and Inorganic Chemistry.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.