Nokibul Islam

4 papers and 24 indexed citations i.

Nokibul Islam has authored 4 papers that have received a total of 24 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 2 papers in Aerospace Engineering and 1 paper in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (2 papers) and Aluminum Alloy Microstructure Properties (2 papers). Nokibul Islam is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (2 papers) and Aluminum Alloy Microstructure Properties (2 papers) and collaborates with scholars based in United States. Nokibul Islam's co-authors include Pradeep Lall, Jeff Suhling, John L. Evans, Jing Liu and Jeffrey C. Suhling and has published in prestigious journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies and Journal of Electronic Packaging.