M. Li
Impact in
- General Materials Science top 2%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 5%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
-
- Intermetallics and Advanced Alloy Properties 4
- Advanced Welding Techniques Analysis 3
-
- Electronic Packaging and Soldering Technologies 10
- 3D IC and TSV technologies 8
- Integrated Circuits and Semiconductor Failure Analysis 1
- Co-authors
- K. N. Tu (2 shared papers)Andriy M. Gusak (1 shared paper)Chan Choy Chum (4 shared papers)Peter Elenius (1 shared paper)Ke Zeng (1 shared paper)Haluk Balkan (1 shared paper)Zhongcai Shao (1 shared paper)K. N. Tu (1 shared paper)
- Journals
- Journal of Electronic Materials (3 papers)Journal of materials research/Pratt's guide to venture capital sources (3 papers)Metallurgical and Materials Transactions A (1 paper)Journal of Materials Science Materials in Electronics (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- SingaporeUnited StatesHong Kong
In The Last Decade
M. Li
10 papers receiving 569 citations
Peers
Comparison fields: 5 of 22
- General Materials Science 49
- Mechanical Engineering 418
- Electrical and Electronic Engineering 556
- Electronic, Optical and Magnetic Materials 62
- Aerospace Engineering 61
Countries citing papers authored by M. Li
This map shows the geographic impact of M. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Li more than expected).
Fields of papers citing papers by M. Li
This network shows the impact of papers produced by M. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Li. The network helps show where M. Li may publish in the future.
Co-authors
The 16 scholars most cited alongside M. Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 324 | |
| 2 | 2002 | 77 | |
| 3 | 2003 | 36 | |
| 4 | 2003 | 32 | |
| 5 | 2002 | 32 | |
| 6 | 2003 | 28 | |
| 7 | 2001 | 22 | |
| 8 | 2005 | 17 | |
| 9 | 2003 | 15 | |
| 10 | 2024 | 1 |
About M. Li
M. Li is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Aerospace Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 10 papers that have together received 584 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers), Intermetallics and Advanced Alloy Properties (4 papers), Advanced Welding Techniques Analysis (3 papers), Aluminum Alloy Microstructure Properties (2 papers), Copper Interconnects and Reliability (1 paper), Integrated Circuits and Semiconductor Failure Analysis (1 paper) and Fatigue and fracture mechanics (1 paper). The work is most often cited by research in General Materials Science (49 citations), Mechanical Engineering (418 citations), Electrical and Electronic Engineering (556 citations), Electronic, Optical and Magnetic Materials (62 citations) and Aerospace Engineering (61 citations). M. Li has collaborated with scholars based in Singapore, United States and Hong Kong. Frequent co-authors include K. N. Tu, Andriy M. Gusak, Chan Choy Chum, Peter Elenius, Ke Zeng, Haluk Balkan, Zhongcai Shao, K. N. Tu, Bavani Balakrisnan and Zhong Chen. Their work appears in journals such as Journal of Electronic Materials, Journal of materials research/Pratt's guide to venture capital sources, Metallurgical and Materials Transactions A, Journal of Materials Science Materials in Electronics and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.