M. Hussein
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Plasma Diagnostics and Applications
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Semiconductor materials and devices 3
- Plasma Diagnostics and Applications 2
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- Copper Interconnects and Reliability 3
- Co-authors
- Jie He (1 shared paper)R. Turkot (2 shared papers)Brian Beattie (1 shared paper)S. Sivakumar (2 shared papers)R. Brain (2 shared papers)P. Nguyen (1 shared paper)G.A. Emmert (1 shared paper)M. I. Fradkin (2 shared papers)
- Partner nations
- United States
In The Last Decade
M. Hussein
6 papers receiving 66 citations
Peers
Comparison fields: 5 of 19
- Electronic, Optical and Magnetic Materials 41
- Electrical and Electronic Engineering 57
- Mechanics of Materials 17
- Atomic and Molecular Physics, and Optics 15
- Ceramics and Composites 2
Countries citing papers authored by M. Hussein
This map shows the geographic impact of M. Hussein's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Hussein with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Hussein more than expected).
Fields of papers citing papers by M. Hussein
This network shows the impact of papers produced by M. Hussein. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Hussein. The network helps show where M. Hussein may publish in the future.
Co-authors
The 15 scholars most cited alongside M. Hussein, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 49 | |
| 2 | 2006 | 11 | |
| 3 | 2003 | 6 | |
| 4 | A Cu interconnect process for the 130 nm process technology node | 2001 | 2 |
| 5 | 1989 | 1 | |
| 6 | 2004 | 1 |
About M. Hussein
M. Hussein is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Aerospace Engineering and Surfaces, Coatings and Films, having authored 6 papers that have together received 70 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (3 papers), Semiconductor materials and devices (3 papers), Advanced Surface Polishing Techniques (3 papers), Nanofabrication and Lithography Techniques (2 papers), Plasma Diagnostics and Applications (2 papers), Particle accelerators and beam dynamics (1 paper), Magnetic confinement fusion research (1 paper) and Optical Coatings and Gratings (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (41 citations), Electrical and Electronic Engineering (57 citations), Mechanics of Materials (17 citations), Atomic and Molecular Physics, and Optics (15 citations) and Ceramics and Composites (2 citations). M. Hussein has collaborated with scholars based in United States. Frequent co-authors include Jie He, R. Turkot, Brian Beattie, S. Sivakumar, R. Brain, P. Nguyen, G.A. Emmert, M. I. Fradkin, P. Smith and Jihperng Leu. Their work appears in journals such as IEEE Transactions on Semiconductor Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.