Larry D. Smith
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 7
- Semiconductor materials and devices 5
- Electromagnetic Compatibility and Noise Suppression 4
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Copper Interconnects and Reliability 4
- Co-authors
- Donald E. Kizer (4 shared papers)Robert E. Jones (1 shared paper)Klaus Hummler (4 shared papers)Sharath Hosali (2 shared papers)Greg Smith (1 shared paper)Eric Bogatin (1 shared paper)Peter A. Boyle (1 shared paper)James Jian-Qiang Lu (1 shared paper)
- Journals
- Journal of Applied Physics (3 papers)BioTechniques (2 papers)Analytical Biochemistry (2 papers)Clinical Biochemistry (1 paper)Biochemical Pharmacology (1 paper)
- Partner nations
- United StatesGermany
In The Last Decade
Larry D. Smith
32 papers receiving 327 citations
Peers
Comparison fields: 5 of 76
- Electrical and Electronic Engineering 229
- Electronic, Optical and Magnetic Materials 69
- Physiology 11
- Automotive Engineering 27
- Hardware and Architecture 15
Countries citing papers authored by Larry D. Smith
This map shows the geographic impact of Larry D. Smith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Larry D. Smith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Larry D. Smith more than expected).
Fields of papers citing papers by Larry D. Smith
This network shows the impact of papers produced by Larry D. Smith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Larry D. Smith. The network helps show where Larry D. Smith may publish in the future.
Co-authors
The 25 scholars most cited alongside Larry D. Smith, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 41 | |
| 2 | 1987 | 40 | |
| 3 | 1969 | 38 | |
| 4 | 2013 | 29 | |
| 5 | 2009 | 28 | |
| 6 | 2014 | 25 | |
| 7 | 1987 | 23 | |
| 8 | 2018 | 16 | |
| 9 | 1970 | 16 | |
| 10 | 2011 | 11 | |
| 11 | 2006 | 10 | |
| 12 | Lane Departure Warning System Research and Test Development | 2007 | 9 |
| 13 | 1977 | 9 | |
| 14 | FPGA Design for Signal and Power Integrity | 2007 | 8 |
| 15 | 2011 | 8 | |
| 16 | Effect of hepatocarcinogens on the adenine purine nucleotide cycle during the initiation phase of carcinogenesis. | 1979 | 7 |
| 17 | 2007 | 6 | |
| 18 | 1985 | 5 | |
| 19 | 1970 | 5 | |
| 20 | Kinetic, immunochemical, and physical studies on purified rat liver adenosine 5'-phosphate deaminase after induction with 3'-methyl-4-dimethylaminoazobenzene or thioacetamide. | 1971 | 5 |
About Larry D. Smith
Larry D. Smith is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Cell Biology, Rheumatology and Clinical Biochemistry, having authored 33 papers that have together received 378 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (7 papers), Semiconductor materials and devices (5 papers), Copper Interconnects and Reliability (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Biochemical and Molecular Research (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Folate and B Vitamins Research (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (229 citations), Electronic, Optical and Magnetic Materials (69 citations), Physiology (11 citations), Automotive Engineering (27 citations) and Hardware and Architecture (15 citations). Larry D. Smith has collaborated with scholars based in United States and Germany. Frequent co-authors include Donald E. Kizer, Robert E. Jones, Klaus Hummler, Sharath Hosali, Greg Smith, Eric Bogatin, Peter A. Boyle, James Jian-Qiang Lu, Michael F. Wilson and Richard B. Triplett. Their work appears in journals such as Journal of Applied Physics, BioTechniques, Analytical Biochemistry, Clinical Biochemistry and Biochemical Pharmacology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.