Kun‐Lin Lin
About
Kun‐Lin Lin has authored 51 papers that have received a total of 546 indexed citations.
This includes 26 papers in Materials Chemistry, 24 papers in Electrical and Electronic Engineering and 15 papers in Mechanical Engineering. The topics of these papers are Advanced ceramic materials synthesis (11 papers), Semiconductor materials and devices (11 papers) and Electronic Packaging and Soldering Technologies (7 papers). Kun‐Lin Lin is often cited by papers focused on Advanced ceramic materials synthesis (11 papers), Semiconductor materials and devices (11 papers) and Electronic Packaging and Soldering Technologies (7 papers) and collaborates with scholars based in Taiwan, United States and Sweden. Kun‐Lin Lin's co-authors include Rajiv Asthana, Mrityunjay Singh, Jitendra N. Tiwari, Chien‐Cheng Lin and Ray‐Hua Horng and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and ACS Applied Materials & Interfaces.
In The Last Decade
Fields of papers published by Kun‐Lin Lin
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Kun‐Lin Lin
Since SpecializationCitations
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