K.C. Hung
About
K.C. Hung has authored 72 papers that have received a total of 1.0k indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 22 papers in Condensed Matter Physics and 14 papers in Biomedical Engineering. The topics of these papers are Physics of Superconductivity and Magnetism (21 papers), Electronic Packaging and Soldering Technologies (18 papers) and 3D IC and TSV technologies (15 papers). K.C. Hung is often cited by papers focused on Physics of Superconductivity and Magnetism (21 papers), Electronic Packaging and Soldering Technologies (18 papers) and 3D IC and TSV technologies (15 papers) and collaborates with scholars based in Hong Kong, Taiwan and China. K.C. Hung's co-authors include Y.C. Chan, Y.C. Chan, C.C. Lam, P.L. Tu and H.M. Shao and has published in prestigious journals such as Proceedings of the National Academy of Sciences, Applied Physics Letters and PLoS ONE.
In The Last Decade
Fields of papers published by K.C. Hung
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by K.C. Hung
Since SpecializationCitations
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