J.W. Dini
Impact in
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- Electrodeposition and Electroless Coatings
- Electronic Packaging and Soldering Technologies
Papers in
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- Electrodeposition and Electroless Coatings 21
- Electronic Packaging and Soldering Technologies 6
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- Advanced Welding Techniques Analysis 9
- Welding Techniques and Residual Stresses 6
- Co-authors
- H.R. Johnson (25 shared papers)David Wood (1 shared paper)J. A. Brooks (2 shared papers)B.J. Schumacher (1 shared paper)G. Koehler (1 shared paper)R.E. Stoltz (1 shared paper)D.B. Hopkins (1 shared paper)Jane Farmer (1 shared paper)
- Journals
- Metal Finishing (3 papers)Precision Engineering (2 papers)Thin Solid Films (2 papers)Journal of Nuclear Materials (2 papers)International Materials Reviews (2 papers)
- Partner nations
- United States
In The Last Decade
J.W. Dini
49 papers receiving 321 citations
Peers
Comparison fields: 5 of 49
- Metals and Alloys 18
- Electrical and Electronic Engineering 209
- Materials Chemistry 167
- Mechanics of Materials 79
- Electrochemistry 19
Countries citing papers authored by J.W. Dini
This map shows the geographic impact of J.W. Dini's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.W. Dini with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.W. Dini more than expected).
Fields of papers citing papers by J.W. Dini
This network shows the impact of papers produced by J.W. Dini. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.W. Dini. The network helps show where J.W. Dini may publish in the future.
Co-authors
The 11 scholars most cited alongside J.W. Dini, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 53 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Electrodeposition: The Materials Science of Coatings and Substrates | 1993 | 173 |
| 2 | 1997 | 16 | |
| 3 | 1978 | 14 | |
| 4 | 1974 | 11 | |
| 5 | 1997 | 10 | |
| 6 | 1997 | 9 | |
| 7 | 1981 | 8 | |
| 8 | 1980 | 6 | |
| 9 | 1983 | 6 | |
| 10 | 1976 | 6 | |
| 11 | 1969 | 5 | |
| 12 | 1992 | 5 | |
| 13 | 1975 | 5 | |
| 14 | 1975 | 5 | |
| 15 | 1975 | 4 | |
| 16 | THICK NICKEL DEPOSITS OF HIGH PURITY BY ELECTROLESS METHODS. | 1966 | 4 |
| 17 | 1977 | 4 | |
| 18 | 1976 | 4 | |
| 19 | 1982 | 3 | |
| 20 | リング・シェア密着性試験 各種のめっき析出層と素地との結合性 | 1974 | 3 |
About J.W. Dini
J.W. Dini is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Aerospace Engineering, having authored 53 papers that have together received 349 indexed citations. Recurring topics across this work include Electrodeposition and Electroless Coatings (21 papers), Metal and Thin Film Mechanics (10 papers), Corrosion Behavior and Inhibition (10 papers), Advanced Welding Techniques Analysis (9 papers), Welding Techniques and Residual Stresses (6 papers), Electronic Packaging and Soldering Technologies (6 papers), Copper Interconnects and Reliability (4 papers) and Hydrogen embrittlement and corrosion behaviors in metals (4 papers). The work is most often cited by research in Metals and Alloys (18 citations), Electrical and Electronic Engineering (209 citations), Materials Chemistry (167 citations), Mechanics of Materials (79 citations) and Electrochemistry (19 citations). J.W. Dini has collaborated with scholars based in United States. Frequent co-authors include H.R. Johnson, David Wood, J. A. Brooks, B.J. Schumacher, G. Koehler, R.E. Stoltz, D.B. Hopkins, Jane Farmer, H. A. Johnsen and M. I. Baskes. Their work appears in journals such as Metal Finishing, Precision Engineering, Thin Solid Films, Journal of Nuclear Materials and International Materials Reviews.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.