Jun‐Mo Yang
Impact in
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- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Ferroelectric and Negative Capacitance Devices
Papers in
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- Semiconductor materials and devices 11
- Thin-Film Transistor Technologies 7
- Electronic Packaging and Soldering Technologies 5
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- Copper Interconnects and Reliability 8
- Co-authors
- Kwan-Yong Lim (4 shared papers)Jae‐Pyoung Ahn (1 shared paper)Dae-Gyu Park (3 shared papers)Youngji Cho (5 shared papers)In‐Seok Yeo (2 shared papers)Jae‐Hyun Kim (2 shared papers)Sang‐Min Kim (1 shared paper)Hak‐Joo Lee (1 shared paper)
- Journals
- Journal of Applied Physics (5 papers)Japanese Journal of Applied Physics (4 papers)Thin Solid Films (2 papers)IEEE Access (2 papers)MATERIALS TRANSACTIONS (2 papers)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Jun‐Mo Yang
48 papers receiving 339 citations
Peers
Comparison fields: 5 of 48
- Electrical and Electronic Engineering 266
- Structural Biology 5
- Electronic, Optical and Magnetic Materials 61
- Materials Chemistry 133
- Mechanical Engineering 65
Countries citing papers authored by Jun‐Mo Yang
This map shows the geographic impact of Jun‐Mo Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jun‐Mo Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jun‐Mo Yang more than expected).
Fields of papers citing papers by Jun‐Mo Yang
This network shows the impact of papers produced by Jun‐Mo Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jun‐Mo Yang. The network helps show where Jun‐Mo Yang may publish in the future.
Co-authors
The 25 scholars most cited alongside Jun‐Mo Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 44 | |
| 2 | 2014 | 39 | |
| 3 | 2002 | 39 | |
| 4 | 2006 | 36 | |
| 5 | 2010 | 24 | |
| 6 | 2011 | 21 | |
| 7 | 2013 | 17 | |
| 8 | 2002 | 13 | |
| 9 | 2013 | 10 | |
| 10 | 2003 | 8 | |
| 11 | 2012 | 7 | |
| 12 | 2013 | 7 | |
| 13 | 2015 | 6 | |
| 14 | 2010 | 6 | |
| 15 | 2011 | 5 | |
| 16 | 2014 | 4 | |
| 17 | Location-aided broadcast in wireless ad hoc networks | 2007 | 4 |
| 18 | 2012 | 4 | |
| 19 | 2019 | 4 | |
| 20 | 2016 | 4 |
About Jun‐Mo Yang
Jun‐Mo Yang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Aerospace Engineering and Condensed Matter Physics, having authored 55 papers that have together received 359 indexed citations. Recurring topics across this work include Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (8 papers), Thin-Film Transistor Technologies (7 papers), Semiconductor materials and interfaces (7 papers), Metal and Thin Film Mechanics (7 papers), Silicon Nanostructures and Photoluminescence (6 papers), ZnO doping and properties (5 papers) and Electronic Packaging and Soldering Technologies (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (266 citations), Structural Biology (5 citations), Electronic, Optical and Magnetic Materials (61 citations), Materials Chemistry (133 citations) and Mechanical Engineering (65 citations). Jun‐Mo Yang has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Kwan-Yong Lim, Jae‐Pyoung Ahn, Dae-Gyu Park, Youngji Cho, In‐Seok Yeo, Jae‐Hyun Kim, Sang‐Min Kim, Hak‐Joo Lee, Seung‐Mo Lee and Do Van Lam. Their work appears in journals such as Journal of Applied Physics, Japanese Journal of Applied Physics, Thin Solid Films, IEEE Access and MATERIALS TRANSACTIONS.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.