J. Beddow
Impact in
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- Rheology and Fluid Dynamics Studies
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Nanomaterials and Printing Technologies 1
- Electronic Packaging and Soldering Technologies 1
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- Material Properties and Processing 1
- Co-authors
- John Evans (1 shared paper)Luke Wentlent (1 shared paper)Peter Børgesen (1 shared paper)Alfred A. Zinn (1 shared paper)
- Journals
- Journal of Electronic Materials (1 paper)IEEE Transactions on Components Hybrids and Manufacturing Technology (1 paper)
- Partner nations
- United StatesCanada
In The Last Decade
J. Beddow
2 papers receiving 59 citations
Peers
Comparison fields: 5 of 22
- Fluid Flow and Transfer Processes 14
- Electrical and Electronic Engineering 40
- General Materials Science 2
- Mechanical Engineering 21
- Mechanics of Materials 13
Countries citing papers authored by J. Beddow
This map shows the geographic impact of J. Beddow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Beddow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Beddow more than expected).
Fields of papers citing papers by J. Beddow
This network shows the impact of papers produced by J. Beddow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Beddow. The network helps show where J. Beddow may publish in the future.
Co-authors
The 4 scholars most cited alongside J. Beddow, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
About J. Beddow
J. Beddow is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Fluid Flow and Transfer Processes, Materials Chemistry and Infectious Diseases, having authored 2 papers that have together received 60 indexed citations. Recurring topics across this work include Nanoporous metals and alloys (1 paper), Nanomaterials and Printing Technologies (1 paper), Electronic Packaging and Soldering Technologies (1 paper), Material Properties and Processing (1 paper), Anodic Oxide Films and Nanostructures (1 paper) and Rheology and Fluid Dynamics Studies (1 paper). The work is most often cited by research in Fluid Flow and Transfer Processes (14 citations), Electrical and Electronic Engineering (40 citations), General Materials Science (2 citations), Mechanical Engineering (21 citations) and Mechanics of Materials (13 citations). J. Beddow has collaborated with scholars based in United States and Canada. Frequent co-authors include John Evans, Luke Wentlent, Peter Børgesen and Alfred A. Zinn. Their work appears in journals such as Journal of Electronic Materials and IEEE Transactions on Components Hybrids and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.