I-Ting Lin

536 citations

15 papers · 392 · h-index 8

Impact in

Polymers and Plastics top 10%
- Polymer composites and self-healing
- Conducting polymers and applications
Biomedical Engineering
- Advanced Sensor and Energy Harvesting Materials
- Dielectric materials and actuators

Papers in

Electrical and Electronic Engineering 6
- Advanced Memory and Neural Computing 2
- 3D IC and TSV technologies 2
- Electronic Packaging and Soldering Technologies 2
Biomedical Engineering 5
- Advanced Sensor and Energy Harvesting Materials 4
- Dielectric materials and actuators 2

Co-authors: Stoyan K. Smoukov (4 shared papers)Tiesheng Wang (3 shared papers)Yeon Sik Choi (2 shared papers)Sohini Kar‐Narayan (2 shared papers)John D. W. Madden (1 shared paper)Jean E. Marshall (1 shared paper)Meisam Farajollahi (1 shared paper)Chaojie Luo (1 shared paper)
Journals: Interface Focus (1 paper)Materials Today (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Polymers (1 paper)Parkinsonism & Related Disorders (1 paper)
Partner nations: Taiwan United Kingdom United States

In The Last Decade

I-Ting Lin

14 papers receiving 387 citations

Peers

Countries citing papers authored by I-Ting Lin

Since Specialization

Citations

This map shows the geographic impact of I-Ting Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I-Ting Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I-Ting Lin more than expected).

Fields of papers citing papers by I-Ting Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by I-Ting Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I-Ting Lin. The network helps show where I-Ting Lin may publish in the future.

Co-authors

The 25 scholars most cited alongside I-Ting Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with I-Ting Lin Line = papers co-authored together I-Ting Lin links everyone, so they are left out of the graph.

All Works

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15 of 15 papers shown

#	Work
1	Electroactive polymers for sensing Interface Focus ·Tiesheng Wang, Meisam Farajollahi, Yeon Sik Choi, I-Ting Lin, Jean E. Marshall, Noel M. Thompson, Sohini Kar‐Narayan, John D. W. Madden, Stoyan K. Smoukov	2016	160
2	Remote, fast actuation of programmable multiple shape memory composites by magnetic fields Journal of Materials Chemistry C ·F. H. Zhang, Zhenbin Zhang, Chaojie Luo, I-Ting Lin, Yanju Liu, Jinsong Leng, Stoyan K. Smoukov	2015	102
3	Comparative single-cell profiling reveals distinct cardiac resident macrophages essential for zebrafish heart regeneration eLife ·Ke-Hsuan Wei, I-Ting Lin, Kaushik Chowdhury, Khai Lone Lim, Kuan‐Ting Liu, Tai‐Ming Ko, Yao‐Ming Chang, Kai‐Chien Yang, Shih-Lei Lai	2023	36
4	Physicochemical Characterization, Biocompatibility, and Antibacterial Properties of CMC/PVA/Calendula officinalis Films for Biomedical Applications Polymers ·Wen‐Hsin Huang, Chia-Yi Hung, Pao-Chang Chiang, Hsiang Lee, I-Ting Lin, Pin‐Chuang Lai, Ya-Hui Chan, Sheng‐Wei Feng	2023	30
5	Electro-responsive surfaces with controllable wrinkling patterns for switchable light reflection–diffusion–grating devices Materials Today ·I-Ting Lin, Yeon Sik Choi, Charles C. Wojcik, Tiesheng Wang, Sohini Kar‐Narayan, Stoyan K. Smoukov	2020	21
6	The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging Chien-Lung Liang, Min‐Yan Tsai, Yung‐Sheng Lin, I-Ting Lin, Shengwen Yang, Min-Lung Huang, Jen-Kuang Fang, Kwang‐Lung Lin	2021	9
7	Fault-Tolerant Electro-Responsive Surfaces for Dynamic Micropattern Molds and Tunable Optics Scientific Reports ·I-Ting Lin, Tiesheng Wang, Fenghua Zhang, Stoyan K. Smoukov	2017	8
8	2.5 A 28nm 142mW Motion-Control SoC for Autonomous Mobile Robots I-Ting Lin, Zih-Sing Fu, Wen-Ching Chen, Liang-Yi Lin, Nian-Shyang Chang, Chun‐Pin Lin, Chi‐Shi Chen, Chia‐Hsiang Yang	2023	7
9	Border-zone cardiomyocytes and macrophages regulate extracellular matrix remodeling to promote cardiomyocyte protrusion during cardiac regeneration Nature Communications ·Florian Constanty, Bai‐Lin Wu, Ke-Hsuan Wei, I-Ting Lin, Julia Dallmann, Stefan Günther, Till Lautenschlaeger, Rashmi Priya, Shih-Lei Lai, Didier Y. R. Stainier, Arica Beisaw	2025	5
10	Post etch killer defect characterization and reduction in a self-aligned double patterning technology Hong-Ji Lee, Sun-Yi Lin, I-Ting Lin, Kuo-Liang Wei, Sheng‐Yuan Chang, Nan-Tzu Lian, Tahone Yang, Kuang‐Chao Chen, Chih‐Yuan Lu	2011	5
11	A 28-nm 25.1 TOPS/W Sparsity-Aware CNN-GCN Deep Learning SoC for Mobile Augmented Reality 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ·Wen-Cong Huang, I-Ting Lin, Wen-Ching Chen, Liang-Yi Lin, Nian-Shyang Chang, Chun‐Pin Lin, Chi‐Shi Chen, Chia‐Hsiang Yang	2022	4
12	A 25.1-TOPS/W Sparsity-Aware Hybrid CNN-GCN Deep Learning SoC for Mobile Augmented Reality IEEE Journal of Solid-State Circuits ·Wen-Cong Huang, I-Ting Lin, Ying-Sheng Lin, Wen-Ching Chen, Liang-Yi Lin, Nian-Shyang Chang, Chun‐Pin Lin, Chi‐Shi Chen, Chia‐Hsiang Yang	2024	2
13	A case of senile-onset progressive hemiballism and cognitive decline with diffuse brain iron accumulations Parkinsonism & Related Disorders ·I-Ting Lin, Ni‐Chung Lee, Sung‐Pin Fan, Chang-Jin Huang, Po-Wei Cheng, Jyh‐Horng Chen, Chin‐Hsien Lin	2022	2
14	Fine-Pitch $30\ \mu \mathrm{m}$ Cu-Cu Bonding using Electroless Nano-Ag Yung‐Sheng Lin, C. Chiang, Yun-Ching Hung, Chin‐Li Kao, Ping-Hung Hsieh, Chih-Yuan Hsu, I-Ting Lin	2023	1
15	A 28-nm 141.4TOPS/W Scalable Reconfigurable Deep Learning SoC for Large-Scale Neural Networks I‐Hsuan Liu, I-Ting Lin, Yueh-Feng Tsai, Jeng-Sheng Hsieh, Vincent Chen, Chuei-Tang Wang, Chia‐Hsiang Yang, Douglas Yu	2024	0

About I-Ting Lin

I-Ting Lin is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Polymers and Plastics and Molecular Biology, having authored 15 papers that have together received 392 indexed citations. Recurring topics across this work include Advanced Sensor and Energy Harvesting Materials (4 papers), Advanced Materials and Mechanics (3 papers), Congenital heart defects research (2 papers), Advanced Memory and Neural Computing (2 papers), Dielectric materials and actuators (2 papers), Advanced Neural Network Applications (2 papers), 3D IC and TSV technologies (2 papers) and Electronic Packaging and Soldering Technologies (2 papers). The work is most often cited by research in Polymers and Plastics (146 citations), Biomedical Engineering (204 citations), Mechanical Engineering (118 citations), Biomaterials (37 citations) and Bioengineering (12 citations). I-Ting Lin has collaborated with scholars based in Taiwan, United Kingdom and United States. Frequent co-authors include Stoyan K. Smoukov, Tiesheng Wang, Yeon Sik Choi, Sohini Kar‐Narayan, John D. W. Madden, Jean E. Marshall, Meisam Farajollahi, Chaojie Luo, Yanju Liu and Jinsong Leng. Their work appears in journals such as Interface Focus, Materials Today, IEEE Journal of Solid-State Circuits, Polymers and Parkinsonism & Related Disorders.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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