Fei‐Yi Hung
Impact in
- Materials Chemistry top 5%
- ZnO doping and properties
- Copper-based nanomaterials and applications
- Mechanical Engineering top 2%
- Aluminum Alloys Composites Properties
- Additive Manufacturing Materials and Processes
Papers in
-
- Electronic Packaging and Soldering Technologies 46
- Gas Sensing Nanomaterials and Sensors 25
- 3D IC and TSV technologies 22
- Advancements in Battery Materials 21
-
- Aluminum Alloys Composites Properties 57
- Advanced Welding Techniques Analysis 24
- Co-authors
- Truan‐Sheng Lui (108 shared papers)Shoou‐Jinn Chang (31 shared papers)Sheng‐Joue Young (6 shared papers)Lihui Chen (29 shared papers)S. J. Chang (2 shared papers)Lihui Chen (15 shared papers)Ting‐Jen Hsueh (9 shared papers)B. T. Dai (8 shared papers)
- Journals
- MATERIALS TRANSACTIONS (44 papers)Metals (17 papers)Materials (12 papers)Microelectronics Reliability (11 papers)Journal of Alloys and Compounds (10 papers)
- Partner nations
- TaiwanAustraliaUnited Kingdom
In The Last Decade
Fei‐Yi Hung
214 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 83
- Materials Chemistry 1.4k
- Mechanical Engineering 1.0k
- Electronic, Optical and Magnetic Materials 479
- Electrical and Electronic Engineering 1.3k
- Biomaterials 247
Countries citing papers authored by Fei‐Yi Hung
This map shows the geographic impact of Fei‐Yi Hung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fei‐Yi Hung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fei‐Yi Hung more than expected).
Fields of papers citing papers by Fei‐Yi Hung
This network shows the impact of papers produced by Fei‐Yi Hung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fei‐Yi Hung. The network helps show where Fei‐Yi Hung may publish in the future.
Co-authors
The 25 scholars most cited alongside Fei‐Yi Hung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 220 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 204 | |
| 2 | 2009 | 186 | |
| 3 | 2011 | 97 | |
| 4 | 2009 | 91 | |
| 5 | 2020 | 86 | |
| 6 | 2013 | 61 | |
| 7 | 2011 | 49 | |
| 8 | 2006 | 41 | |
| 9 | 2011 | 38 | |
| 10 | 2020 | 31 | |
| 11 | 2010 | 29 | |
| 12 | 2005 | 29 | |
| 13 | 2011 | 29 | |
| 14 | 2015 | 27 | |
| 15 | 2015 | 27 | |
| 16 | 2015 | 26 | |
| 17 | 2005 | 26 | |
| 18 | 2017 | 26 | |
| 19 | 2015 | 26 | |
| 20 | 2015 | 25 |
About Fei‐Yi Hung
Fei‐Yi Hung is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Aerospace Engineering and Electronic, Optical and Magnetic Materials, having authored 220 papers that have together received 2.6k indexed citations. Recurring topics across this work include Aluminum Alloys Composites Properties (57 papers), Electronic Packaging and Soldering Technologies (46 papers), Aluminum Alloy Microstructure Properties (39 papers), ZnO doping and properties (38 papers), Gas Sensing Nanomaterials and Sensors (25 papers), Advanced Welding Techniques Analysis (24 papers), 3D IC and TSV technologies (22 papers) and Advancements in Battery Materials (21 papers). The work is most often cited by research in Materials Chemistry (1.4k citations), Mechanical Engineering (1.0k citations), Electronic, Optical and Magnetic Materials (479 citations), Electrical and Electronic Engineering (1.3k citations) and Biomaterials (247 citations). Fei‐Yi Hung has collaborated with scholars based in Taiwan, Australia and United Kingdom. Frequent co-authors include Truan‐Sheng Lui, Shoou‐Jinn Chang, Sheng‐Joue Young, Lihui Chen, S. J. Chang, Lihui Chen, Ting‐Jen Hsueh, B. T. Dai, Hsin-Ta Hsueh and Cheng‐Liang Hsu. Their work appears in journals such as MATERIALS TRANSACTIONS, Metals, Materials, Microelectronics Reliability and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.