E.C. Hammel
Impact in
- Ceramics and Composites top 2%
- Advanced ceramic materials synthesis
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- Advanced ceramic materials synthesis 3
-
- Thermal properties of materials 4
- Carbon Nanotubes in Composites 1
- Co-authors
- Okenwa Izeji Okoli (3 shared papers)Osayande L. Ighodaro (1 shared paper)Markus Trampert (1 shared paper)K. Mauthner (1 shared paper)Petra Pötschke (1 shared paper)Xin Yan Tang (1 shared paper)Thomas Schmitt (1 shared paper)J. Nicolics (2 shared papers)
- Journals
- Ceramics International (3 papers)Carbon (1 paper)IEEE/CPMT International Electronics Manufacturing Technology Symposium (1 paper)International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (1 paper)International Workshop on Thermal Investigations of ICs and Systems (1 paper)
- Partner nations
- United StatesAustriaGermany
In The Last Decade
E.C. Hammel
8 papers receiving 914 citations
E.C. Hammel's Hit Papers
Peers
Comparison fields: 5 of 44
- Ceramics and Composites 278
- Automotive Engineering 66
- Materials Chemistry 289
- Mechanical Engineering 163
- Polymers and Plastics 50
Countries citing papers authored by E.C. Hammel
This map shows the geographic impact of E.C. Hammel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E.C. Hammel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E.C. Hammel more than expected).
Fields of papers citing papers by E.C. Hammel
This network shows the impact of papers produced by E.C. Hammel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E.C. Hammel. The network helps show where E.C. Hammel may publish in the future.
Co-authors
The 8 scholars most cited alongside E.C. Hammel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | Processing and properties of advanced porous ceramics: An application based review Hit paper breakdown → | 2014 | 464 |
| 2 | 2004 | 453 | |
| 3 | 2010 | 6 | |
| 4 | 2017 | 6 | |
| 5 | Carbon nanotube enhanced thermally conductive phase change material for heat dissipation | 2009 | 5 |
| 6 | 2018 | 3 | |
| 7 | 2003 | 2 | |
| 8 | Silicon substrates with microwhisker structure: An innovative heat spreader technology for power electronics application | 1999 | 1 |
About E.C. Hammel
E.C. Hammel is a scholar working on Ceramics and Composites, Materials Chemistry, Mechanical Engineering, Food Science and Electrical and Electronic Engineering, having authored 8 papers that have together received 940 indexed citations. Recurring topics across this work include Thermal properties of materials (4 papers), Advanced ceramic materials synthesis (3 papers), Heat Transfer and Optimization (2 papers), Food Drying and Modeling (1 paper), Electronic Packaging and Soldering Technologies (1 paper), Carbon Nanotubes in Composites (1 paper), Phase Change Materials Research (1 paper) and Heat Transfer and Boiling Studies (1 paper). The work is most often cited by research in Ceramics and Composites (278 citations), Automotive Engineering (66 citations), Materials Chemistry (289 citations), Mechanical Engineering (163 citations) and Polymers and Plastics (50 citations). E.C. Hammel has collaborated with scholars based in United States, Austria and Germany. Frequent co-authors include Okenwa Izeji Okoli, Osayande L. Ighodaro, Markus Trampert, K. Mauthner, Petra Pötschke, Xin Yan Tang, Thomas Schmitt and J. Nicolics. Their work appears in journals such as Ceramics International, Carbon, IEEE/CPMT International Electronics Manufacturing Technology Symposium, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) and International Workshop on Thermal Investigations of ICs and Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.