Da‐Wei Wang
Impact in
- Polymers and Plastics top 5%
- Conducting polymers and applications
-
- Organic Electronics and Photovoltaics
- Microwave and Dielectric Measurement Techniques
- Microwave Engineering and Waveguides
- Perovskite Materials and Applications
Papers in
-
- Microwave Engineering and Waveguides 24
- 3D IC and TSV technologies 19
- Microwave and Dielectric Measurement Techniques 18
- Semiconductor materials and devices 14
- Electromagnetic Compatibility and Noise Suppression 10
- Advanced Memory and Neural Computing 9
-
- Acoustic Wave Resonator Technologies 14
- Co-authors
- Wen‐Sheng Zhao (82 shared papers)Gaofeng Wang (33 shared papers)Wen‐Yan Yin (31 shared papers)Qi Liu (8 shared papers)Congxu Wang (1 shared paper)Ni Yin (1 shared paper)Yaokai Li (1 shared paper)Lijian Zuo (1 shared paper)
- Journals
- IEEE Sensors Journal (8 papers)IEEE Transactions on Electron Devices (7 papers)IEEE Access (6 papers)IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (5 papers)IEEE Transactions on Electromagnetic Compatibility (5 papers)
- Partner nations
- ChinaUnited StatesJapan
In The Last Decade
Da‐Wei Wang
101 papers receiving 1.9k citations
Da‐Wei Wang's Hit Papers
Peers
Comparison fields: 5 of 74
- Polymers and Plastics 405
- Electrical and Electronic Engineering 1.6k
- Biomedical Engineering 559
- Electronic, Optical and Magnetic Materials 138
- Aerospace Engineering 162
Countries citing papers authored by Da‐Wei Wang
This map shows the geographic impact of Da‐Wei Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Da‐Wei Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Da‐Wei Wang more than expected).
Fields of papers citing papers by Da‐Wei Wang
This network shows the impact of papers produced by Da‐Wei Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Da‐Wei Wang. The network helps show where Da‐Wei Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Da‐Wei Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 126 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Self‐Assembled Interlayer Enables High‐Performance Organic Photovoltaics with Power Conversion Efficiency Exceeding 20% Hit paper breakdown → | 2024 | 543 |
| 2 | 2020 | 141 | |
| 3 | 2021 | 95 | |
| 4 | 2020 | 79 | |
| 5 | 2022 | 75 | |
| 6 | 2021 | 51 | |
| 7 | 2017 | 40 | |
| 8 | 2018 | 39 | |
| 9 | 2021 | 37 | |
| 10 | 2018 | 34 | |
| 11 | 2015 | 33 | |
| 12 | 2020 | 33 | |
| 13 | 2022 | 30 | |
| 14 | 2022 | 30 | |
| 15 | 2019 | 29 | |
| 16 | 2022 | 28 | |
| 17 | 2023 | 26 | |
| 18 | 2014 | 26 | |
| 19 | 2016 | 25 | |
| 20 | 2020 | 23 |
About Da‐Wei Wang
Da‐Wei Wang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 126 papers that have together received 1.9k indexed citations. Recurring topics across this work include Microwave Engineering and Waveguides (24 papers), 3D IC and TSV technologies (19 papers), Microwave and Dielectric Measurement Techniques (18 papers), Semiconductor materials and devices (14 papers), Acoustic Wave Resonator Technologies (14 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Advanced Memory and Neural Computing (9 papers) and Advanced Antenna and Metasurface Technologies (9 papers). The work is most often cited by research in Polymers and Plastics (405 citations), Electrical and Electronic Engineering (1.6k citations), Biomedical Engineering (559 citations), Electronic, Optical and Magnetic Materials (138 citations) and Aerospace Engineering (162 citations). Da‐Wei Wang has collaborated with scholars based in China, United States and Japan. Frequent co-authors include Wen‐Sheng Zhao, Gaofeng Wang, Wen‐Yan Yin, Qi Liu, Congxu Wang, Ni Yin, Yaokai Li, Lijian Zuo, Qi Chen and Hongzheng Chen. Their work appears in journals such as IEEE Sensors Journal, IEEE Transactions on Electron Devices, IEEE Access, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and IEEE Transactions on Electromagnetic Compatibility.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.