Daniel Schwab
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Measurements
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- Wireless Networks and Protocols
- Mobile Ad Hoc Networks
Papers in
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- 3D IC and TSV technologies 8
- Electromagnetic Compatibility and Noise Suppression 7
- Radio Frequency Integrated Circuit Design 4
- Integrated Circuits and Semiconductor Failure Analysis 3
- Electronic Packaging and Soldering Technologies 3
- Advancements in PLL and VCO Technologies 3
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- VLSI and Analog Circuit Testing 3
- Co-authors
- Richard B. Bunt (1 shared paper)Barry K. Gilbert (21 shared papers)Patrick R. Hayes (1 shared paper)Guang-Tsai Lei (1 shared paper)Robert W. Techentin (1 shared paper)Erik S. Daniel (7 shared papers)Michael F. Zaeh (1 shared paper)Jan Bernd Habedank (1 shared paper)
- Journals
- IEEE Journal of Solid-State Circuits (2 papers)Cerebrovascular Diseases (1 paper)Journal of Laser Applications (1 paper)IEEE Transactions on Instrumentation and Measurement (1 paper)IEEE Transactions on Advanced Packaging (1 paper)
- Partner nations
- United StatesGermanyCanada
In The Last Decade
Daniel Schwab
23 papers receiving 314 citations
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 267
- Computer Networks and Communications 89
- Aerospace Engineering 54
- Transportation 11
- Astronomy and Astrophysics 21
Countries citing papers authored by Daniel Schwab
This map shows the geographic impact of Daniel Schwab's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel Schwab with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel Schwab more than expected).
Fields of papers citing papers by Daniel Schwab
This network shows the impact of papers produced by Daniel Schwab. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel Schwab. The network helps show where Daniel Schwab may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel Schwab, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1995 | 129 | |
| 2 | 2005 | 87 | |
| 3 | 2020 | 24 | |
| 4 | 2009 | 20 | |
| 5 | 2001 | 12 | |
| 6 | 2008 | 12 | |
| 7 | 2006 | 10 | |
| 8 | 1985 | 7 | |
| 9 | 2007 | 7 | |
| 10 | 1986 | 4 | |
| 11 | 2002 | 4 | |
| 12 | 2014 | 4 | |
| 13 | 1984 | 3 | |
| 14 | 1996 | 3 | |
| 15 | 1997 | 3 | |
| 16 | A Measurement-Quality Body-Worn Sensor-Agnostic Physiological Monitor for Biomedical Applications | 2015 | 3 |
| 17 | 2012 | 2 | |
| 18 | 2007 | 2 | |
| 19 | 1986 | 1 | |
| 20 | 2003 | 1 |
About Daniel Schwab
Daniel Schwab is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Vision and Pattern Recognition, Biomedical Engineering and Physiology, having authored 29 papers that have together received 341 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (8 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Radio Frequency Integrated Circuit Design (4 papers), VLSI and Analog Circuit Testing (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Electronic Packaging and Soldering Technologies (3 papers), Context-Aware Activity Recognition Systems (3 papers) and Advancements in PLL and VCO Technologies (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (267 citations), Computer Networks and Communications (89 citations), Aerospace Engineering (54 citations), Transportation (11 citations) and Astronomy and Astrophysics (21 citations). Daniel Schwab has collaborated with scholars based in United States, Germany and Canada. Frequent co-authors include Richard B. Bunt, Barry K. Gilbert, Patrick R. Hayes, Guang-Tsai Lei, Robert W. Techentin, Erik S. Daniel, Michael F. Zaeh, Jan Bernd Habedank, B.A. Randall and James A. Levine. Their work appears in journals such as IEEE Journal of Solid-State Circuits, Cerebrovascular Diseases, Journal of Laser Applications, IEEE Transactions on Instrumentation and Measurement and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.