David B. Tuckerman
Impact in
- Mechanical Engineering top 0.2%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
- Biomedical Engineering top 2%
- Nanofluid Flow and Heat Transfer
Papers in
-
- 3D IC and TSV technologies 15
- Radio Frequency Integrated Circuit Design 9
- Electronic Packaging and Soldering Technologies 8
- Microwave Engineering and Waveguides 8
- Semiconductor materials and devices 7
- Co-authors
- R. F. W. Pease (9 shared papers)Yoav Peles (1 shared paper)Srinivas Garimella (1 shared paper)Satish G. Kandlikar (1 shared paper)Stéphane Colin (1 shared paper)Juergen J. Brandner (1 shared paper)Andrew H. Weisberg (2 shared papers)J. H. Magerlein (1 shared paper)
- Journals
- IEEE Transactions on Applied Superconductivity (11 papers)Applied Physics Letters (5 papers)IEEE Electron Device Letters (4 papers)Superconductor Science and Technology (3 papers)Applied Surface Science (1 paper)
- Partner nations
- United StatesAustraliaIndia
In The Last Decade
David B. Tuckerman
46 papers receiving 4.7k citations
David B. Tuckerman's Hit Papers
Peers
Comparison fields: 5 of 66
- Mechanical Engineering 4.0k
- Biomedical Engineering 1.3k
- Computational Mechanics 589
- Electrical and Electronic Engineering 1.1k
- Renewable Energy, Sustainability and the Environment 291
Countries citing papers authored by David B. Tuckerman
This map shows the geographic impact of David B. Tuckerman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David B. Tuckerman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David B. Tuckerman more than expected).
Fields of papers citing papers by David B. Tuckerman
This network shows the impact of papers produced by David B. Tuckerman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David B. Tuckerman. The network helps show where David B. Tuckerman may publish in the future.
Co-authors
The 25 scholars most cited alongside David B. Tuckerman, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 50 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | High-performance heat sinking for VLSI Hit paper breakdown → | 1981 | 4004 |
| 2 | 2013 | 229 | |
| 3 | Heat-transfer microstructures for integrated circuits | 1984 | 170 |
| 4 | 1988 | 63 | |
| 5 | 2016 | 49 | |
| 6 | 1986 | 44 | |
| 7 | 1980 | 42 | |
| 8 | 1980 | 41 | |
| 9 | 1981 | 24 | |
| 10 | 2002 | 18 | |
| 11 | 2019 | 16 | |
| 12 | 1987 | 15 | |
| 13 | 2011 | 14 | |
| 14 | 2016 | 13 | |
| 15 | 1989 | 12 | |
| 16 | 1978 | 11 | |
| 17 | 2017 | 10 | |
| 18 | 2016 | 9 | |
| 19 | 2017 | 9 | |
| 20 | 1990 | 8 |
About David B. Tuckerman
David B. Tuckerman is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Condensed Matter Physics, Mechanics of Materials and Computational Mechanics, having authored 50 papers that have together received 4.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Radio Frequency Integrated Circuit Design (9 papers), Physics of Superconductivity and Magnetism (8 papers), Electronic Packaging and Soldering Technologies (8 papers), Microwave Engineering and Waveguides (8 papers), Semiconductor materials and devices (7 papers), Copper Interconnects and Reliability (6 papers) and Laser Material Processing Techniques (6 papers). The work is most often cited by research in Mechanical Engineering (4.0k citations), Biomedical Engineering (1.3k citations), Computational Mechanics (589 citations), Electrical and Electronic Engineering (1.1k citations) and Renewable Energy, Sustainability and the Environment (291 citations). David B. Tuckerman has collaborated with scholars based in United States, Australia and India. Frequent co-authors include R. F. W. Pease, Yoav Peles, Srinivas Garimella, Satish G. Kandlikar, Stéphane Colin, Juergen J. Brandner, Andrew H. Weisberg, J. H. Magerlein, Michael C. Hamilton and Charles D. Ellis. Their work appears in journals such as IEEE Transactions on Applied Superconductivity, Applied Physics Letters, IEEE Electron Device Letters, Superconductor Science and Technology and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.