Daniel N. Huff
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced DC-DC Converters
Papers in
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- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 7
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- Silicon and Solar Cell Technologies 3
- Surgery 8
- Orthopaedic implants and arthroplasty 8
- Total Knee Arthroplasty Outcomes 4
- Co-authors
- Rolando P. Burgos (1 shared paper)Dushan Boroyevich (1 shared paper)F. Wang (1 shared paper)Manas Ranjan Dash (2 shared papers)Zhiguo Wang (2 shared papers)F. Patrick McCluskey (2 shared papers)Rixin Lai (3 shared papers)Khai D. T. Ngo (3 shared papers)
- Journals
- Journal of ASTM International (2 papers)Journal of Orthopaedic Research® (2 papers)Clinical Biomechanics (2 papers)Microelectronics Reliability (1 paper)IEEE Transactions on Power Electronics (1 paper)
- Partner nations
- United StatesAustraliaNew Zealand
In The Last Decade
Daniel N. Huff
25 papers receiving 479 citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 335
- Ceramics and Composites 27
- Mechanical Engineering 127
- Surgery 115
- General Materials Science 4
Countries citing papers authored by Daniel N. Huff
This map shows the geographic impact of Daniel N. Huff's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel N. Huff with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel N. Huff more than expected).
Fields of papers citing papers by Daniel N. Huff
This network shows the impact of papers produced by Daniel N. Huff. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel N. Huff. The network helps show where Daniel N. Huff may publish in the future.
Co-authors
The 25 scholars most cited alongside Daniel N. Huff, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 26 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 117 | |
| 2 | 2009 | 96 | |
| 3 | 2006 | 80 | |
| 4 | 2017 | 37 | |
| 5 | 2018 | 27 | |
| 6 | 2002 | 21 | |
| 7 | 2018 | 20 | |
| 8 | 2004 | 17 | |
| 9 | 2018 | 17 | |
| 10 | 2018 | 11 | |
| 11 | 2009 | 11 | |
| 12 | 2021 | 9 | |
| 13 | 2006 | 8 | |
| 14 | 2020 | 7 | |
| 15 | 2020 | 5 | |
| 16 | 2002 | 4 | |
| 17 | 2001 | 4 | |
| 18 | 2008 | 3 | |
| 19 | 2004 | 2 | |
| 20 | 2002 | 2 |
About Daniel N. Huff
Daniel N. Huff is a scholar working on Electrical and Electronic Engineering, Surgery, Mechanics of Materials, Civil and Structural Engineering and Mechanical Engineering, having authored 26 papers that have together received 505 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Orthopaedic implants and arthroplasty (8 papers), 3D IC and TSV technologies (7 papers), Silicon Carbide Semiconductor Technologies (5 papers), Total Knee Arthroplasty Outcomes (4 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Silicon and Solar Cell Technologies (3 papers) and Structural Engineering and Vibration Analysis (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (335 citations), Ceramics and Composites (27 citations), Mechanical Engineering (127 citations), Surgery (115 citations) and General Materials Science (4 citations). Daniel N. Huff has collaborated with scholars based in United States, Australia and New Zealand. Frequent co-authors include Rolando P. Burgos, Dushan Boroyevich, F. Wang, Manas Ranjan Dash, Zhiguo Wang, F. Patrick McCluskey, Rixin Lai, Khai D. T. Ngo, Puqi Ning and Fei Wang. Their work appears in journals such as Journal of ASTM International, Journal of Orthopaedic Research®, Clinical Biomechanics, Microelectronics Reliability and IEEE Transactions on Power Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.