Chulmin Oh
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Injection Molding Process and Properties
Papers in
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- Electronic Packaging and Soldering Technologies 36
- 3D IC and TSV technologies 23
- Silicon and Solar Cell Technologies 4
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- Aluminum Alloys Composites Properties 8
- Advanced Welding Techniques Analysis 3
- Advanced materials and composites 3
- Co-authors
- Shijo Nagao (6 shared papers)Katsuaki Suganuma (6 shared papers)Won Sik Hong (12 shared papers)Dajung Kim (12 shared papers)Mi Song Kim (3 shared papers)Keun Lee (2 shared papers)Yuchen Liu (1 shared paper)Hao Zhang (1 shared paper)
- Journals
- Journal of Materials Science Materials in Electronics (6 papers)Journal of Electronic Materials (6 papers)Microelectronics Reliability (5 papers)International Journal of Technology Management (2 papers)Journal of Materials Research and Technology (1 paper)
- Partner nations
- South KoreaJapanTaiwan
In The Last Decade
Chulmin Oh
47 papers receiving 490 citations
Peers
Comparison fields: 5 of 52
- Electrical and Electronic Engineering 392
- Mechanical Engineering 194
- Business and International Management 10
- Electronic, Optical and Magnetic Materials 69
- Ceramics and Composites 20
Countries citing papers authored by Chulmin Oh
This map shows the geographic impact of Chulmin Oh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chulmin Oh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chulmin Oh more than expected).
Fields of papers citing papers by Chulmin Oh
This network shows the impact of papers produced by Chulmin Oh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chulmin Oh. The network helps show where Chulmin Oh may publish in the future.
Co-authors
The 25 scholars most cited alongside Chulmin Oh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 75 | |
| 2 | 2014 | 47 | |
| 3 | 2015 | 34 | |
| 4 | 2019 | 31 | |
| 5 | 2016 | 28 | |
| 6 | 2015 | 25 | |
| 7 | 2014 | 20 | |
| 8 | 2018 | 18 | |
| 9 | 2014 | 17 | |
| 10 | 2013 | 16 | |
| 11 | 2012 | 14 | |
| 12 | 2016 | 14 | |
| 13 | 2019 | 12 | |
| 14 | 1998 | 11 | |
| 15 | 2016 | 11 | |
| 16 | 2019 | 11 | |
| 17 | 2015 | 11 | |
| 18 | 2017 | 10 | |
| 19 | 2019 | 9 | |
| 20 | 2012 | 8 |
About Chulmin Oh
Chulmin Oh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Civil and Structural Engineering and Mechanics of Materials, having authored 52 papers that have together received 516 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (23 papers), Aluminum Alloys Composites Properties (8 papers), Copper Interconnects and Reliability (8 papers), Silicon and Solar Cell Technologies (4 papers), Advanced Welding Techniques Analysis (3 papers), Engineering Applied Research (3 papers) and Advanced materials and composites (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (392 citations), Mechanical Engineering (194 citations), Business and International Management (10 citations), Electronic, Optical and Magnetic Materials (69 citations) and Ceramics and Composites (20 citations). Chulmin Oh has collaborated with scholars based in South Korea, Japan and Taiwan. Frequent co-authors include Shijo Nagao, Katsuaki Suganuma, Won Sik Hong, Dajung Kim, Mi Song Kim, Keun Lee, Yuchen Liu, Hao Zhang, Shih‐kang Lin and Changwoon Han. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Electronic Materials, Microelectronics Reliability, International Journal of Technology Management and Journal of Materials Research and Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.