Changhai Wang
Impact in
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- Heusler alloys: electronic and magnetic properties
- Gold and Silver Nanoparticles Synthesis and Applications
- Biomedical Engineering top 5%
- Advanced Sensor and Energy Harvesting Materials
Papers in
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- 3D IC and TSV technologies 12
- Advanced MEMS and NEMS Technologies 11
- Nanomaterials and Printing Technologies 9
- Electronic Packaging and Soldering Technologies 9
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- Advanced Sensor and Energy Harvesting Materials 15
- Co-authors
- Wendong Yang (10 shared papers)Valeria Arrighi (7 shared papers)Y. Hwu (8 shared papers)Claudia Felser (11 shared papers)Emil List (1 shared paper)Gerhard H. Fecher (9 shared papers)Rodica Voicu (5 shared papers)R. Müller (5 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (6 papers)Journal of Materials Chemistry C (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)Microsystem Technologies (3 papers)Journal of Microelectromechanical Systems (2 papers)
- Partner nations
- United KingdomChinaGermany
In The Last Decade
Changhai Wang
78 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 121
- Electronic, Optical and Magnetic Materials 384
- Biomedical Engineering 533
- Electrical and Electronic Engineering 619
- Materials Chemistry 495
- Automotive Engineering 95
Countries citing papers authored by Changhai Wang
This map shows the geographic impact of Changhai Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Changhai Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Changhai Wang more than expected).
Fields of papers citing papers by Changhai Wang
This network shows the impact of papers produced by Changhai Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Changhai Wang. The network helps show where Changhai Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Changhai Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 83 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 126 | |
| 2 | 2019 | 103 | |
| 3 | 2019 | 76 | |
| 4 | 2022 | 56 | |
| 5 | 2015 | 55 | |
| 6 | 2014 | 54 | |
| 7 | 2006 | 53 | |
| 8 | 2017 | 51 | |
| 9 | 2009 | 49 | |
| 10 | 2017 | 46 | |
| 11 | 2009 | 41 | |
| 12 | 2015 | 30 | |
| 13 | 2022 | 30 | |
| 14 | 2010 | 27 | |
| 15 | 2017 | 26 | |
| 16 | 2014 | 26 | |
| 17 | 2007 | 26 | |
| 18 | 2012 | 25 | |
| 19 | 2001 | 25 | |
| 20 | 2012 | 23 |
About Changhai Wang
Changhai Wang is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 83 papers that have together received 1.5k indexed citations. Recurring topics across this work include Advanced Sensor and Energy Harvesting Materials (15 papers), 3D IC and TSV technologies (12 papers), Advanced MEMS and NEMS Technologies (11 papers), Heusler alloys: electronic and magnetic properties (10 papers), Nanomaterials and Printing Technologies (9 papers), Electronic Packaging and Soldering Technologies (9 papers), Force Microscopy Techniques and Applications (5 papers) and Advanced Antenna and Metasurface Technologies (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (384 citations), Biomedical Engineering (533 citations), Electrical and Electronic Engineering (619 citations), Materials Chemistry (495 citations) and Automotive Engineering (95 citations). Changhai Wang has collaborated with scholars based in United Kingdom, China and Germany. Frequent co-authors include Wendong Yang, Valeria Arrighi, Y. Hwu, Claudia Felser, Emil List, Gerhard H. Fecher, Rodica Voicu, R. Müller, Benjamin Balke and J. H. Je. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Materials Chemistry C, IEEE Transactions on Components Packaging and Manufacturing Technology, Microsystem Technologies and Journal of Microelectromechanical Systems.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.