Microelectronics International

4.6k citations
632 papers · · active since 2016

Impact in

    • Electronic Packaging and Soldering Technologies
    • 3D IC and TSV technologies
    • Electrical and Thermal Properties of Materials
    • Semiconductor materials and devices
    • Gas Sensing Nanomaterials and Sensors
    • Microwave Dielectric Ceramics Synthesis
    • Electromagnetic Compatibility and Noise Suppression

Papers in

    • Electronic Packaging and Soldering Technologies 148
    • 3D IC and TSV technologies 117
    • Electrical and Thermal Properties of Materials 92
    • Advancements in Semiconductor Devices and Circuit Design 51
    • Semiconductor materials and devices 51
    • Microwave Dielectric Ceramics Synthesis 40
    • Gas Sensing Nanomaterials and Sensors 37

Microelectronics International

581 papers receiving 4.3k citations

Peers

Microelectronics International
Comparison fields: 5 of 128
  • Electrical and Electronic Engineering 3.4k
  • Bioengineering 159
  • Biomedical Engineering 1.1k
  • Materials Chemistry 1.0k
  • Mechanical Engineering 818
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Microelectronics International relative to Active and Passive Electronic Components India Active and Passive Electronic Components's profile →
Citations per field
00.5×2×3×3.6×
Active and Passive Electronic Components · 1×
Citations per year

Countries where authors publish in Microelectronics International

Since Specialization
Citations

This map shows the geographic impact of research published in Microelectronics International. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in Microelectronics International with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Microelectronics International more than expected).

Fields of papers published in Microelectronics International

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in Microelectronics International. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in Microelectronics International.

About Microelectronics International

The 632 papers published in Microelectronics International in the last decades have received a total of 4.6k indexed citations . Papers published in Microelectronics International usually cover Electrical and Electronic Engineering (537 papers), Biomedical Engineering (153 papers), Bioengineering (19 papers), Condensed Matter Physics (34 papers) and Materials Chemistry (128 papers) specifically the topics of Electronic Packaging and Soldering Technologies (148 papers), 3D IC and TSV technologies (117 papers), Electrical and Thermal Properties of Materials (92 papers), Advancements in Semiconductor Devices and Circuit Design (51 papers), Semiconductor materials and devices (51 papers), Ferroelectric and Piezoelectric Materials (46 papers), Microwave Dielectric Ceramics Synthesis (40 papers) and Gas Sensing Nanomaterials and Sensors (37 papers). The most active scholars publishing in Microelectronics International are John Hon-Shing Lau, Z.W. Zhong, Bob Willis, Vijaya R. Puri, Brajesh Kumar Kaushik, Michael Gerard Pecht, Krzysztof Górecki, Rajesh Agarwal, Y. Srinivasa Rao and Michael Hintz.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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