B. Dang

11 papers and 561 indexed citations i.

B. Dang has authored 11 papers that have received a total of 561 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 3 papers in Atomic and Molecular Physics, and Optics and 2 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and interfaces (3 papers). B. Dang is often cited by papers focused on 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and interfaces (3 papers) and collaborates with scholars based in United States, Japan and Vietnam. B. Dang's co-authors include Paul Andry, S. L. Wright, C.S. Patel, Bucknell C. Webb and E. Sprogis and has published in prestigious journals such as IEEE Electron Device Letters, IBM Journal of Research and Development and Journal of Microelectromechanical Systems.