Andy Fan
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 22
- Electronic Packaging and Soldering Technologies 17
- Semiconductor materials and devices 4
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- Biosensors and Analytical Detection 7
- Co-authors
- R. Reif (20 shared papers)Kuan‐Neng Chen (19 shared papers)Chuan Seng Tan (16 shared papers)Catherine M. Klapperich (20 shared papers)Shamik Das (3 shared papers)Natalia M. Rodriguez (3 shared papers)Jacqueline C. Linnes (3 shared papers)Nira R. Pollock (1 shared paper)
- Journals
- Journal of Electronic Materials (5 papers)Applied Physics Letters (4 papers)Electrochemical and Solid-State Letters (3 papers)RSC Advances (2 papers)PLoS ONE (2 papers)
- Partner nations
- United StatesSingaporeFrance
In The Last Decade
Andy Fan
43 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 105
- Electrical and Electronic Engineering 1.1k
- Automotive Engineering 204
- Electronic, Optical and Magnetic Materials 260
- Hardware and Architecture 98
- Biomedical Engineering 570
Countries citing papers authored by Andy Fan
This map shows the geographic impact of Andy Fan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andy Fan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andy Fan more than expected).
Fields of papers citing papers by Andy Fan
This network shows the impact of papers produced by Andy Fan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andy Fan. The network helps show where Andy Fan may publish in the future.
Co-authors
The 25 scholars most cited alongside Andy Fan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 172 | |
| 2 | 2015 | 166 | |
| 3 | 2003 | 140 | |
| 4 | 2004 | 121 | |
| 5 | 2003 | 97 | |
| 6 | 2017 | 88 | |
| 7 | 2002 | 83 | |
| 8 | 2014 | 73 | |
| 9 | 2020 | 69 | |
| 10 | 2021 | 64 | |
| 11 | 2005 | 62 | |
| 12 | 2013 | 61 | |
| 13 | 2004 | 61 | |
| 14 | 2001 | 60 | |
| 15 | 2006 | 57 | |
| 16 | 2003 | 42 | |
| 17 | 2003 | 39 | |
| 18 | 2004 | 39 | |
| 19 | 2002 | 36 | |
| 20 | 2018 | 29 |
About Andy Fan
Andy Fan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Infectious Diseases and Molecular Biology, having authored 43 papers that have together received 1.8k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (17 papers), Copper Interconnects and Reliability (11 papers), Biosensors and Analytical Detection (7 papers), Semiconductor materials and devices (4 papers), HIV Research and Treatment (4 papers), Bacteriophages and microbial interactions (4 papers) and Advanced biosensing and bioanalysis techniques (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.1k citations), Automotive Engineering (204 citations), Electronic, Optical and Magnetic Materials (260 citations), Hardware and Architecture (98 citations) and Biomedical Engineering (570 citations). Andy Fan has collaborated with scholars based in United States, Singapore and France. Frequent co-authors include R. Reif, Kuan‐Neng Chen, Chuan Seng Tan, Catherine M. Klapperich, Shamik Das, Natalia M. Rodriguez, Jacqueline C. Linnes, Nira R. Pollock, Marjon Zamani and Bertrand Lemieux. Their work appears in journals such as Journal of Electronic Materials, Applied Physics Letters, Electrochemical and Solid-State Letters, RSC Advances and PLoS ONE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.