Journal of Microelectronics and Electronic Packaging
About
The 344 papers published in Journal of Microelectronics and Electronic Packaging in the last decades have received a total of 1.1k indexed citations.
Papers published in Journal of Microelectronics and Electronic Packaging usually cover Electrical and Electronic Engineering (290 papers), Mechanical Engineering (71 papers) and Materials Chemistry (62 papers) specifically the topics of Electronic Packaging and Soldering Technologies (144 papers), 3D IC and TSV technologies (114 papers) and Electrical and Thermal Properties of Materials (54 papers). The most active scholars publishing in Journal of Microelectronics and Electronic Packaging are John H. Lau, Martin Hoffmann, Jens Müller, M.Z. Abdullah and Robert N. Dean.
In The Last Decade
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Countries where authors publish in Journal of Microelectronics and Electronic Packaging
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