Journal of Microelectronics and Electronic Packaging
About
The 353 papers published in Journal of Microelectronics and Electronic Packaging in the last decades have received a total of 1.2k indexed citations.
Papers published in Journal of Microelectronics and Electronic Packaging usually cover Electrical and Electronic Engineering (299 papers), Mechanical Engineering (72 papers) and Materials Chemistry (62 papers) specifically the topics of Electronic Packaging and Soldering Technologies (152 papers), 3D IC and TSV technologies (121 papers) and Electrical and Thermal Properties of Materials (54 papers). The most active scholars publishing in Journal of Microelectronics and Electronic Packaging are John H. Lau, Jianbiao Pan, Peter Rodgers, Liang‐Yu Chen, E. H. Linfield, Daniel J. Arenas, Michael T. Lanagan, R. Mittra, Jens Müller and Mira Naftaly.
In The Last Decade
Fields of papers published in Journal of Microelectronics and Electronic Packaging
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
This network shows the specialization of papers published in Journal of Microelectronics and Electronic Packaging. Nodes represent fields, and links connect fields that are likely to share authors.
Countries where authors publish in Journal of Microelectronics and Electronic Packaging
Since SpecializationTotal citations of papers
This map shows the geographic distribution of research published in Journal of Microelectronics and Electronic Packaging. It shows the number of citations received by papers published by authors working in each country. You can also color the map by specialization and compare the number of papers published in Journal of Microelectronics and Electronic Packaging with the expected number of papers based on a country's size and research output (numbers larger than one mean the country's share of papers is larger than expected).
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