Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions
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doi.org/10.1126/sciadv.abj1663 →Countries where authors are citing Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions
This map shows the geographic impact of Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions more than expected).
Fields of papers citing Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions
This network shows the impact of Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions.
About Hierarchically porous polyimide/Ti 3 C 2 T x film with stable electromagnetic interference shielding after resisting harsh conditions
This paper, published in 2021, received 221 indexed citations . Written by Xuanyang Li, Yuting Fang, Guanglei Liu, Zengyao Wang, John Matz, Pei Dong, Jianfeng Shen and Mingxin Ye covering the research area of Electronic, Optical and Magnetic Materials, Materials Chemistry and Aerospace Engineering. It is primarily cited by scholars working on Electronic, Optical and Magnetic Materials (173 citations), Aerospace Engineering (104 citations), Materials Chemistry (98 citations), Biomedical Engineering (55 citations) and Polymers and Plastics (28 citations). Published in Science Advances.
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This paper is also available at doi.org/10.1126/sciadv.abj1663.