Z. Lai
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 5%
- Additive Manufacturing Materials and Processes
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 5
- Semiconductor materials and devices 4
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- Aluminum Alloys Composites Properties 4
- Advanced Welding Techniques Analysis 3
- Co-authors
- J. Liu (6 shared papers)L.-Y. Wei (1 shared paper)Anders Snis (1 shared paper)Aqsa Safdar (1 shared paper)Haitao Jiang (1 shared paper)Yu Yan (1 shared paper)Helge Kristiansen (1 shared paper)Cynthia Khoo (1 shared paper)
- Journals
- Journal of Crystal Growth (2 papers)Applied Physics Letters (2 papers)Semiconductor Science and Technology (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Wear (1 paper)
- Partner nations
- SwedenChinaUnited States
In The Last Decade
Z. Lai
41 papers receiving 925 citations
Peers
Comparison fields: 5 of 52
- Electrical and Electronic Engineering 620
- Mechanical Engineering 383
- Automotive Engineering 123
- Metals and Alloys 17
- Mechanics of Materials 159
Countries citing papers authored by Z. Lai
This map shows the geographic impact of Z. Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Z. Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Z. Lai more than expected).
Fields of papers citing papers by Z. Lai
This network shows the impact of papers produced by Z. Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Z. Lai. The network helps show where Z. Lai may publish in the future.
Co-authors
The 25 scholars most cited alongside Z. Lai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 41 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 210 | |
| 2 | 2005 | 105 | |
| 3 | 1999 | 92 | |
| 4 | 2002 | 54 | |
| 5 | 1994 | 52 | |
| 6 | 2007 | 52 | |
| 7 | 1997 | 45 | |
| 8 | 2000 | 36 | |
| 9 | 2001 | 35 | |
| 10 | 1998 | 33 | |
| 11 | 2011 | 29 | |
| 12 | 2000 | 22 | |
| 13 | 1996 | 21 | |
| 14 | 2007 | 21 | |
| 15 | 2002 | 21 | |
| 16 | 2008 | 19 | |
| 17 | 2024 | 14 | |
| 18 | 2002 | 12 | |
| 19 | 2015 | 9 | |
| 20 | 1998 | 8 |
About Z. Lai
Z. Lai is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atomic and Molecular Physics, and Optics, Materials Chemistry and Biomedical Engineering, having authored 41 papers that have together received 967 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (11 papers), Semiconductor Quantum Structures and Devices (6 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Aluminum Alloys Composites Properties (4 papers), Semiconductor materials and devices (4 papers), Advanced Welding Techniques Analysis (3 papers) and Aluminum Alloy Microstructure Properties (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (620 citations), Mechanical Engineering (383 citations), Automotive Engineering (123 citations), Metals and Alloys (17 citations) and Mechanics of Materials (159 citations). Z. Lai has collaborated with scholars based in Sweden, China and United States. Frequent co-authors include J. Liu, L.-Y. Wei, Anders Snis, Aqsa Safdar, Haitao Jiang, Yu Yan, Helge Kristiansen, Cynthia Khoo, Anders Larsson and A.R. Thölén. Their work appears in journals such as Journal of Crystal Growth, Applied Physics Letters, Semiconductor Science and Technology, IEEE Transactions on Components and Packaging Technologies and Wear.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.