Yufeng Jin
About
Yufeng Jin has authored 54 papers that have received a total of 232 indexed citations.
This includes 41 papers in Electrical and Electronic Engineering, 6 papers in Materials Chemistry and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (8 papers). Yufeng Jin is often cited by papers focused on 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (14 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in China, Singapore and United States. Yufeng Jin's co-authors include Shenglin Ma, Yan Yang and Min Miao and has published in prestigious journals such as American Journal of Clinical Nutrition, Nanoscale and Nutrients.
In The Last Decade
side by side view
Countries citing papers authored by Yufeng Jin
Since SpecializationCitations
Explore authors with similar magnitude of impact
Breakdown of academic impact, for papers by Walid Abdel Maksoud Breakdown of academic impact, for papers by Anant Gokarn Breakdown of academic impact, for papers by Jie Zhan Breakdown of academic impact, for papers by Daniel Mureșan Breakdown of academic impact, for papers by Ridi Ferdiana Breakdown of academic impact, for papers by Ye Yuan Breakdown of academic impact, for papers by Clarissa Pinto Pizarro de Freitas Breakdown of academic impact, for papers by Lili Wang