Yishu Wang
About
Yishu Wang has authored 72 papers that have received a total of 471 indexed citations.
This includes 44 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 13 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (23 papers) and Aluminum Alloys Composites Properties (13 papers). Yishu Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (33 papers), 3D IC and TSV technologies (23 papers) and Aluminum Alloys Composites Properties (13 papers) and collaborates with scholars based in China, United States and Taiwan. Yishu Wang's co-authors include Fu Guo, Fu Guo, Sihong Liu, Jing Han and Yufeng Wu and has published in prestigious journals such as Applied Physics Letters, Journal of Cleaner Production and Chemical Engineering Journal.
In The Last Decade
Fields of papers published by Yishu Wang
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Yishu Wang
Since SpecializationCitations
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