Yiping Wu

56 papers and 589 indexed citations i.

Yiping Wu has authored 56 papers that have received a total of 589 indexed citations. This includes 40 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 14 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (16 papers) and Advanced Welding Techniques Analysis (11 papers). Yiping Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (16 papers) and Advanced Welding Techniques Analysis (11 papers) and collaborates with scholars based in China, Australia and United Kingdom. Yiping Wu's co-authors include Bing An, Changsheng Xie, Liang Chen, Zhiwen Chen and Fengshun Wu and has published in prestigious journals such as Optics Letters, Sensors and Journal of Alloys and Compounds.