Weishen Chu
Impact in
- Media Technology top 5%
- Advanced Image Fusion Techniques
-
- Image Enhancement Techniques
- Advanced Image Processing Techniques
- Image and Signal Denoising Methods
- Advanced Vision and Imaging
Papers in
-
- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 5
- Advancements in Battery Materials 2
-
- Image Enhancement Techniques 4
- Advanced Image Processing Techniques 3
- Co-authors
- Jingchun Zhou (4 shared papers)Weishi Zhang (3 shared papers)Paul S. Ho (4 shared papers)Wei Li (2 shared papers)Jianmin Hu (1 shared paper)Cheng Sun (1 shared paper)Xiangfan Chen (1 shared paper)Evan Baker (1 shared paper)
- Journals
- ACS Applied Materials & Interfaces (1 paper)Computer Modeling in Engineering & Sciences (1 paper)Optics Express (1 paper)Computers & Electrical Engineering (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- United StatesChinaNew Zealand
In The Last Decade
Weishen Chu
22 papers receiving 441 citations
Peers
Comparison fields: 5 of 87
- Media Technology 74
- Computer Vision and Pattern Recognition 173
- Acoustics and Ultrasonics 3
- Automotive Engineering 38
- Electrical and Electronic Engineering 137
Countries citing papers authored by Weishen Chu
This map shows the geographic impact of Weishen Chu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Weishen Chu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Weishen Chu more than expected).
Fields of papers citing papers by Weishen Chu
This network shows the impact of papers produced by Weishen Chu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Weishen Chu. The network helps show where Weishen Chu may publish in the future.
Co-authors
The 25 scholars most cited alongside Weishen Chu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 118 | |
| 2 | 2021 | 77 | |
| 3 | 2022 | 50 | |
| 4 | 2017 | 42 | |
| 5 | 2021 | 36 | |
| 6 | 2022 | 25 | |
| 7 | 2021 | 25 | |
| 8 | 2021 | 15 | |
| 9 | 2020 | 12 | |
| 10 | 2020 | 10 | |
| 11 | 2022 | 10 | |
| 12 | 2022 | 8 | |
| 13 | 1970 | 7 | |
| 14 | 2022 | 5 | |
| 15 | 2021 | 3 | |
| 16 | 2025 | 2 | |
| 17 | 2021 | 2 | |
| 18 | 2021 | 2 | |
| 19 | 2023 | 1 | |
| 20 | 2021 | 1 |
About Weishen Chu
Weishen Chu is a scholar working on Electrical and Electronic Engineering, Computer Vision and Pattern Recognition, Materials Chemistry, Biomedical Engineering and Mechanical Engineering, having authored 22 papers that have together received 453 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Image Enhancement Techniques (4 papers), Advanced Image Processing Techniques (3 papers), Graphene research and applications (2 papers), Supply Chain and Inventory Management (2 papers), Graphene and Nanomaterials Applications (2 papers) and Advancements in Battery Materials (2 papers). The work is most often cited by research in Media Technology (74 citations), Computer Vision and Pattern Recognition (173 citations), Acoustics and Ultrasonics (3 citations), Automotive Engineering (38 citations) and Electrical and Electronic Engineering (137 citations). Weishen Chu has collaborated with scholars based in United States, China and New Zealand. Frequent co-authors include Jingchun Zhou, Weishi Zhang, Paul S. Ho, Wei Li, Jianmin Hu, Cheng Sun, Xiangfan Chen, Evan Baker, Henry Oliver T. Ware and Tengfei Jiang. Their work appears in journals such as ACS Applied Materials & Interfaces, Computer Modeling in Engineering & Sciences, Optics Express, Computers & Electrical Engineering and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.