Weishen Chu
Impact in
- Media Technology top 5%
- Advanced Image Fusion Techniques
-
- Image Enhancement Techniques
- Advanced Image Processing Techniques
- Image and Signal Denoising Methods
Papers in
-
- 3D IC and TSV technologies 5
- Electronic Packaging and Soldering Technologies 5
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- Image Enhancement Techniques 4
- Advanced Image Processing Techniques 3
- Co-authors
- Jingchun Zhou (4 shared papers)Weishi Zhang (3 shared papers)Paul S. Ho (4 shared papers)Wei Li (2 shared papers)Jianmin Hu (1 shared paper)Henry Oliver T. Ware (1 shared paper)Cheng Sun (1 shared paper)Evan Baker (1 shared paper)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)Optics Express (1 paper)Computer Modeling in Engineering & Sciences (1 paper)Engineering Applications of Artificial Intelligence (1 paper)
- Partner nations
- United StatesChinaNew Zealand
In The Last Decade
Weishen Chu
20 papers receiving 412 citations
Peers
Comparison fields: 5 of 83
- Media Technology 73
- Computer Vision and Pattern Recognition 161
- Automotive Engineering 36
- Electrical and Electronic Engineering 134
- Acoustics and Ultrasonics 2
Countries citing papers authored by Weishen Chu
This map shows the geographic impact of Weishen Chu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Weishen Chu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Weishen Chu more than expected).
Fields of papers citing papers by Weishen Chu
This network shows the impact of papers produced by Weishen Chu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Weishen Chu. The network helps show where Weishen Chu may publish in the future.
Co-authors
The 25 scholars most cited alongside Weishen Chu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 21 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 109 | |
| 2 | 2021 | 77 | |
| 3 | 2022 | 46 | |
| 4 | 2017 | 40 | |
| 5 | 2021 | 36 | |
| 6 | 2022 | 25 | |
| 7 | 2021 | 22 | |
| 8 | 2021 | 14 | |
| 9 | 2020 | 11 | |
| 10 | 2020 | 10 | |
| 11 | 2022 | 10 | |
| 12 | 2022 | 8 | |
| 13 | 1970 | 7 | |
| 14 | 2022 | 4 | |
| 15 | 2021 | 3 | |
| 16 | 2021 | 2 | |
| 17 | 2021 | 1 | |
| 18 | 2021 | 1 | |
| 19 | 2023 | 1 | |
| 20 | 2022 | 1 |
About Weishen Chu
Weishen Chu is a scholar working on Electrical and Electronic Engineering, Computer Vision and Pattern Recognition, Biomedical Engineering, Materials Chemistry and Mechanical Engineering, having authored 21 papers that have together received 428 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (5 papers), Image Enhancement Techniques (4 papers), Advanced Image Processing Techniques (3 papers), Supply Chain and Inventory Management (2 papers), Copper Interconnects and Reliability (2 papers), Advanced Image Fusion Techniques (2 papers) and Graphene and Nanomaterials Applications (2 papers). The work is most often cited by research in Media Technology (73 citations), Computer Vision and Pattern Recognition (161 citations), Automotive Engineering (36 citations), Electrical and Electronic Engineering (134 citations) and Acoustics and Ultrasonics (2 citations). Weishen Chu has collaborated with scholars based in United States, China and New Zealand. Frequent co-authors include Jingchun Zhou, Weishi Zhang, Paul S. Ho, Wei Li, Jianmin Hu, Henry Oliver T. Ware, Cheng Sun, Evan Baker, Xiangfan Chen and Yi Lin. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, Optics Express, Computer Modeling in Engineering & Sciences and Engineering Applications of Artificial Intelligence.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.