T.Y. Lin
Impact in
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- Electronic Packaging and Soldering Technologies
- Fuel Cells and Related Materials
- Silicon Carbide Semiconductor Technologies
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- Heat Transfer and Optimization
- Heat Transfer Mechanisms
Papers in
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- Electronic Packaging and Soldering Technologies 18
- Electrostatic Discharge in Electronics 6
- Silicon Carbide Semiconductor Technologies 4
- Semiconductor materials and devices 2
- Advancements in Semiconductor Devices and Circuit Design 2
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- Analog and Mixed-Signal Circuit Design 5
- Co-authors
- Andrew A. O. Tay (6 shared papers)Zijie Lu (1 shared paper)Dwight Cooke (1 shared paper)Michael M. Daino (1 shared paper)Satish G. Kandlikar (1 shared paper)Chauchin Su (5 shared papers)Yingchieh Ho (4 shared papers)Sheng Liu (1 shared paper)
- Journals
- Microelectronics Reliability (4 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)IEEE Transactions on Electron Devices (2 papers)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- TaiwanSingaporeUnited States
In The Last Decade
T.Y. Lin
37 papers receiving 500 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 402
- Mechanical Engineering 88
- Computational Mechanics 38
- Condensed Matter Physics 19
- Mechanics of Materials 28
Countries citing papers authored by T.Y. Lin
This map shows the geographic impact of T.Y. Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.Y. Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.Y. Lin more than expected).
Fields of papers citing papers by T.Y. Lin
This network shows the impact of papers produced by T.Y. Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.Y. Lin. The network helps show where T.Y. Lin may publish in the future.
Co-authors
The 25 scholars most cited alongside T.Y. Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 42 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 96 | |
| 2 | 1999 | 55 | |
| 3 | 2007 | 51 | |
| 4 | 2002 | 35 | |
| 5 | 2002 | 30 | |
| 6 | 2003 | 27 | |
| 7 | 2006 | 27 | |
| 8 | 2012 | 23 | |
| 9 | 2003 | 18 | |
| 10 | 2003 | 17 | |
| 11 | 1978 | 13 | |
| 12 | 2002 | 13 | |
| 13 | 2003 | 12 | |
| 14 | 2003 | 12 | |
| 15 | 2017 | 12 | |
| 16 | 2007 | 10 | |
| 17 | 2005 | 9 | |
| 18 | 2002 | 8 | |
| 19 | 2006 | 8 | |
| 20 | 2008 | 8 |
About T.Y. Lin
T.Y. Lin is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Computational Mechanics and Cardiology and Cardiovascular Medicine, having authored 42 papers that have together received 549 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), Electrostatic Discharge in Electronics (6 papers), Analog and Mixed-Signal Circuit Design (5 papers), Heat Transfer and Optimization (4 papers), Silicon Carbide Semiconductor Technologies (4 papers), Semiconductor materials and devices (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers) and Heat Transfer Mechanisms (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (402 citations), Mechanical Engineering (88 citations), Computational Mechanics (38 citations), Condensed Matter Physics (19 citations) and Mechanics of Materials (28 citations). T.Y. Lin has collaborated with scholars based in Taiwan, Singapore and United States. Frequent co-authors include Andrew A. O. Tay, Zijie Lu, Dwight Cooke, Michael M. Daino, Satish G. Kandlikar, Chauchin Su, Yingchieh Ho, Sheng Liu, Yi Ma and Mingxiang Chen. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electron Devices, IEEE Transactions on Electronics Packaging Manufacturing and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.