Todd Salamon
Impact in
- Surfaces, Coatings and Films top 0.5%
- Surface Modification and Superhydrophobicity
- Computational Mechanics top 2%
- Fluid Dynamics and Thin Films
- Fluid Dynamics and Heat Transfer
Papers in
-
- Heat Transfer and Optimization 26
- Heat Transfer and Boiling Studies 24
- Refrigeration and Air Conditioning Technologies 7
-
- Fluid Dynamics and Thin Films 8
- Co-authors
- Paul Kolodner (11 shared papers)Tom N. Krupenkin (6 shared papers)J. Ashley Taylor (2 shared papers)Edgar Lobatón (2 shared papers)Marc Hodes (11 shared papers)Evelyn N. Wang (7 shared papers)Robert A. Brown (6 shared papers)Robert C. Armstrong (6 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)Physics of Fluids (4 papers)Bell Labs Technical Journal (2 papers)Langmuir (2 papers)Journal of Electronic Packaging (2 papers)
- Partner nations
- United StatesSwitzerlandIreland
In The Last Decade
Todd Salamon
53 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 77
- Surfaces, Coatings and Films 644
- Computational Mechanics 603
- Fluid Flow and Transfer Processes 136
- Mechanical Engineering 430
- Mechanics of Materials 230
Countries citing papers authored by Todd Salamon
This map shows the geographic impact of Todd Salamon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Todd Salamon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Todd Salamon more than expected).
Fields of papers citing papers by Todd Salamon
This network shows the impact of papers produced by Todd Salamon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Todd Salamon. The network helps show where Todd Salamon may publish in the future.
Co-authors
The 25 scholars most cited alongside Todd Salamon, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 56 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 311 | |
| 2 | 2007 | 238 | |
| 3 | 2018 | 144 | |
| 4 | 1994 | 111 | |
| 5 | 1995 | 75 | |
| 6 | 2007 | 69 | |
| 7 | 2016 | 67 | |
| 8 | 2013 | 56 | |
| 9 | 2010 | 56 | |
| 10 | 2020 | 54 | |
| 11 | 1995 | 29 | |
| 12 | 2006 | 21 | |
| 13 | 1990 | 16 | |
| 14 | 2005 | 16 | |
| 15 | 1997 | 16 | |
| 16 | 2012 | 15 | |
| 17 | 2017 | 13 | |
| 18 | 1997 | 12 | |
| 19 | 2017 | 10 | |
| 20 | 2017 | 10 |
About Todd Salamon
Todd Salamon is a scholar working on Mechanical Engineering, Computational Mechanics, Surfaces, Coatings and Films, Electrical and Electronic Engineering and Materials Chemistry, having authored 56 papers that have together received 1.4k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (26 papers), Heat Transfer and Boiling Studies (24 papers), Surface Modification and Superhydrophobicity (12 papers), Fluid Dynamics and Thin Films (8 papers), Refrigeration and Air Conditioning Technologies (7 papers), Optical Network Technologies (5 papers), Rheology and Fluid Dynamics Studies (5 papers) and Semiconductor Lasers and Optical Devices (4 papers). The work is most often cited by research in Surfaces, Coatings and Films (644 citations), Computational Mechanics (603 citations), Fluid Flow and Transfer Processes (136 citations), Mechanical Engineering (430 citations) and Mechanics of Materials (230 citations). Todd Salamon has collaborated with scholars based in United States, Switzerland and Ireland. Frequent co-authors include Paul Kolodner, Tom N. Krupenkin, J. Ashley Taylor, Edgar Lobatón, Marc Hodes, Evelyn N. Wang, Robert A. Brown, Robert C. Armstrong, Alexander Sidorenko and Victor A. Lifton. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Physics of Fluids, Bell Labs Technical Journal, Langmuir and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.