Tingrun Lai

761 citations
18 papers · 559 · h-index 10

Impact in

Papers in

Tingrun Lai

18 papers receiving 552 citations

Peers

Tingrun Lai
Comparison fields: 5 of 51
  • Bioengineering 175
  • Electrochemistry 51
  • Electrical and Electronic Engineering 422
  • Polymers and Plastics 77
  • Biomedical Engineering 199
Replace Linfeng Su with:
Linfeng Su China
Juan Casanova‐Cháfer Spain
Hanyang Ji China
Shirin Movaghgharnezhad United States
Chul Han Kwon South Korea
Valeriy Krivetskiy Russia
Chunxiao Yin China
Kubilay Arıkan Türkiye
Sayan Dey India
Hongyi Qin China
Tingrun Lai relative to Linfeng Su China Linfeng Su's profile →
Citations per field
00.5×1.5×2.2×
Linfeng Su · 1×
Citations per year

Countries citing papers authored by Tingrun Lai

Since Specialization
Citations

This map shows the geographic impact of Tingrun Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tingrun Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tingrun Lai more than expected).

Fields of papers citing papers by Tingrun Lai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tingrun Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tingrun Lai. The network helps show where Tingrun Lai may publish in the future.

Co-authors

The 25 scholars most cited alongside Tingrun Lai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Tingrun Lai Line = papers co-authored together Tingrun Lai links everyone, so they are left out of the graph.

All Works

18 of 18 papers shown
#Work
1 2021209
2 2021156
3 202240
4 202125
5 202419
6 202119
7 202416
8 202314
9 202214
10 202312
11 20238
12 20218
13 20257
14 20256
15 20223
16 20221
17 20221
18 20251

About Tingrun Lai

Tingrun Lai is a scholar working on Electrical and Electronic Engineering, Electrochemistry, Biomedical Engineering, Polymers and Plastics and Molecular Biology, having authored 18 papers that have together received 559 indexed citations. Recurring topics across this work include Electrochemical sensors and biosensors (7 papers), Electrochemical Analysis and Applications (6 papers), Conducting polymers and applications (4 papers), Advancements in Battery Materials (4 papers), Advanced Chemical Sensor Technologies (4 papers), Advanced Battery Materials and Technologies (3 papers), Advanced Battery Technologies Research (3 papers) and Gas Sensing Nanomaterials and Sensors (3 papers). The work is most often cited by research in Bioengineering (175 citations), Electrochemistry (51 citations), Electrical and Electronic Engineering (422 citations), Polymers and Plastics (77 citations) and Biomedical Engineering (199 citations). Tingrun Lai has collaborated with scholars based in China, Canada and Poland. Frequent co-authors include Yude Wang, Xuechun Xiao, Xiuxiu Cui, Zhichao Yang, Jie Ren, Mingjing Xiao, Bingsen Wang, Tian Xu, Yuxiu Li and Lijia Yao. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Chemical Engineering Journal, Nanotechnology, Energy storage materials and Nano Materials Science.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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