Tim S. Cale
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Plasma Diagnostics and Applications
- Electronic Packaging and Soldering Technologies
Papers in
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- Copper Interconnects and Reliability 25
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- Semiconductor materials and devices 23
- 3D IC and TSV technologies 16
- Plasma Diagnostics and Applications 14
- Electronic Packaging and Soldering Technologies 13
- Co-authors
- Gregory B. Raupp (15 shared papers)Ronald J. Gutmann (20 shared papers)Stephen P. Beaudoin (3 shared papers)T. Bibby (3 shared papers)Karey L. Holland (2 shared papers)Bridget R. Rogers (11 shared papers)Jian‐Qiang Lu (13 shared papers)Duo Wang (1 shared paper)
- Journals
- Thin Solid Films (10 papers)Journal of The Electrochemical Society (5 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (4 papers)Journal of Catalysis (4 papers)Chemical Engineering Communications (4 papers)
- Partner nations
- United StatesSwedenAustria
In The Last Decade
Tim S. Cale
84 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 66
- Electronic, Optical and Magnetic Materials 256
- Electrical and Electronic Engineering 795
- Mechanics of Materials 271
- Biomedical Engineering 431
- Materials Chemistry 346
Countries citing papers authored by Tim S. Cale
This map shows the geographic impact of Tim S. Cale's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tim S. Cale with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tim S. Cale more than expected).
Fields of papers citing papers by Tim S. Cale
This network shows the impact of papers produced by Tim S. Cale. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tim S. Cale. The network helps show where Tim S. Cale may publish in the future.
Co-authors
The 25 scholars most cited alongside Tim S. Cale, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 88 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 144 | |
| 2 | 1990 | 107 | |
| 3 | 1997 | 86 | |
| 4 | 2006 | 68 | |
| 5 | 1990 | 49 | |
| 6 | 1990 | 49 | |
| 7 | 1991 | 33 | |
| 8 | 1989 | 33 | |
| 9 | 1991 | 29 | |
| 10 | 2004 | 29 | |
| 11 | 2002 | 28 | |
| 12 | 2002 | 27 | |
| 13 | 1983 | 26 | |
| 14 | 1998 | 26 | |
| 15 | 1992 | 26 | |
| 16 | 1990 | 24 | |
| 17 | 2003 | 21 | |
| 18 | 1998 | 19 | |
| 19 | 2006 | 19 | |
| 20 | 1993 | 18 |
About Tim S. Cale
Tim S. Cale is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Biomedical Engineering and Materials Chemistry, having authored 88 papers that have together received 1.3k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (23 papers), Metal and Thin Film Mechanics (22 papers), 3D IC and TSV technologies (16 papers), Advanced Surface Polishing Techniques (15 papers), Plasma Diagnostics and Applications (14 papers), Electronic Packaging and Soldering Technologies (13 papers) and Nanofabrication and Lithography Techniques (7 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (256 citations), Electrical and Electronic Engineering (795 citations), Mechanics of Materials (271 citations), Biomedical Engineering (431 citations) and Materials Chemistry (346 citations). Tim S. Cale has collaborated with scholars based in United States, Sweden and Austria. Frequent co-authors include Gregory B. Raupp, Ronald J. Gutmann, Stephen P. Beaudoin, T. Bibby, Karey L. Holland, Bridget R. Rogers, Jian‐Qiang Lu, Duo Wang, J. Jay McMahon and Yongchai Kwon. Their work appears in journals such as Thin Solid Films, Journal of The Electrochemical Society, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, Journal of Catalysis and Chemical Engineering Communications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.