T. Ko
Impact in
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- 3D IC and TSV technologies
- Advancements in Photolithography Techniques
- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
- Advancements in PLL and VCO Technologies
- Advancements in Semiconductor Devices and Circuit Design
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 4
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- 3D IC and TSV technologies 3
- Co-authors
- Douglas Yu (2 shared papers)Chuei-Tang Wang (1 shared paper)C. T. Wang (1 shared paper)Ming-Hsien Tsai (4 shared papers)Chun-Hsing Shih (4 shared papers)C.H. Hsieh (1 shared paper)Chih-Sheng Chang (1 shared paper)M.S. Liang (3 shared papers)
- Journals
- 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2 papers)Technical digest - International Electron Devices Meeting/Technical digest (1 paper)IEEE International Interconnect Technology Conference (IITC) (1 paper)Symposium on VLSI Technology (1 paper)
- Partner nations
- Taiwan
In The Last Decade
T. Ko
7 papers receiving 44 citations
Peers
Comparison fields: 5 of 9
- Electrical and Electronic Engineering 48
- Electronic, Optical and Magnetic Materials 11
- Fluid Flow and Transfer Processes 1
- Hardware and Architecture 1
- Polymers and Plastics 1
Countries citing papers authored by T. Ko
This map shows the geographic impact of T. Ko's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T. Ko with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T. Ko more than expected).
Fields of papers citing papers by T. Ko
This network shows the impact of papers produced by T. Ko. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T. Ko. The network helps show where T. Ko may publish in the future.
Co-authors
The 8 scholars most cited alongside T. Ko, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 22 | |
| 2 | 2020 | 15 | |
| 3 | 2005 | 8 | |
| 4 | 2004 | 7 | |
| 5 | 2024 | 3 | |
| 6 | 2006 | 2 | |
| 7 | 2005 | 1 |
About T. Ko
T. Ko is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Nuclear Energy and Engineering, Waste Management and Disposal and Infectious Diseases, having authored 7 papers that have together received 58 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (4 papers) and 3D IC and TSV technologies (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (48 citations), Electronic, Optical and Magnetic Materials (11 citations), Fluid Flow and Transfer Processes (1 citation), Hardware and Architecture (1 citation) and Polymers and Plastics (1 citation). T. Ko has collaborated with scholars based in Taiwan. Frequent co-authors include Douglas Yu, Chuei-Tang Wang, C. T. Wang, Ming-Hsien Tsai, Chun-Hsing Shih, C.H. Hsieh, Chih-Sheng Chang and M.S. Liang. Their work appears in journals such as 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), Technical digest - International Electron Devices Meeting/Technical digest, IEEE International Interconnect Technology Conference (IITC) and Symposium on VLSI Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.