S. Sakamoto
About
S. Sakamoto has authored 6 papers that have received a total of 297 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 1 paper in Atmospheric Science. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Aluminum Alloys Composites Properties (2 papers). S. Sakamoto is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (4 papers) and Aluminum Alloys Composites Properties (2 papers) and collaborates with scholars based in Japan. S. Sakamoto's co-authors include Katsuaki Suganuma, Tohru Sugahara, Shijo Nagao, Nobuyuki Kanematsu and F. Takasaki and has published in prestigious journals such as Materials Letters, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment and Microelectronics Reliability.
In The Last Decade
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