Ruixue Ding

1.4k citations

123 papers · 1.1k · h-index 19

Impact in

Electrical and Electronic Engineering top 5%
- 3D IC and TSV technologies
- CCD and CMOS Imaging Sensors
- Advancements in Semiconductor Devices and Circuit Design
- Electronic Packaging and Soldering Technologies
- Low-power high-performance VLSI design
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
Biomedical Engineering top 10%
- Analog and Mixed-Signal Circuit Design

Papers in

Electrical and Electronic Engineering 113
- Advancements in Semiconductor Devices and Circuit Design 36
- CCD and CMOS Imaging Sensors 36
- 3D IC and TSV technologies 27
- Advancements in PLL and VCO Technologies 24
- Radio Frequency Integrated Circuit Design 18
- Semiconductor materials and devices 14
- Electromagnetic Compatibility and Noise Suppression 14
Biomedical Engineering 73
- Analog and Mixed-Signal Circuit Design 69

Co-authors: Zhangming Zhu (94 shared papers)Yintang Yang (26 shared papers)Xiaoxian Liu (14 shared papers)Yintang Yang (9 shared papers)Qijun Lu (8 shared papers)Shubin Liu (45 shared papers)Maliang Liu (9 shared papers)Yuhua Liang (9 shared papers)
Journals: Analog Integrated Circuits and Signal Processing (14 papers)IEEE Microwave and Wireless Components Letters (9 papers)IEEE Transactions on Circuits & Systems II Express Briefs (8 papers)IEEE Transactions on Circuits and Systems I Regular Papers (6 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (5 papers)
Partner nations: China United States Portugal

In The Last Decade

Ruixue Ding

109 papers receiving 1.0k citations

Peers

Countries citing papers authored by Ruixue Ding

Since Specialization

Citations

This map shows the geographic impact of Ruixue Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ruixue Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ruixue Ding more than expected).

Fields of papers citing papers by Ruixue Ding

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ruixue Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ruixue Ding. The network helps show where Ruixue Ding may publish in the future.

Co-authors

The 25 scholars most cited alongside Ruixue Ding, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Ruixue Ding Line = papers co-authored together Ruixue Ding links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 123 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	A 6-to-10-Bit 0.5 V-to-0.9 V Reconfigurable 2 MS/s Power Scalable SAR ADC in 0.18 <formula formulatype="inline"> <tex Notation="TeX">$\mu{\rm m}$</tex></formula> CMOS IEEE Transactions on Circuits and Systems I Regular Papers ·Zhangming Zhu, Zheng Qiu, Maliang Liu, Ruixue Ding	2014	67
2	Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias IEEE Transactions on Electron Devices ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding	2015	53
3	A 9.1ENOB 200MS/s Asynchronous SAR ADC With Hybrid Single-Ended/Differential DAC in 55-nm CMOS for Image Sensing Signals IEEE Sensors Journal ·Yuhua Liang, Ruixue Ding, Zhangming Zhu	2018	50
4	Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone IEEE Transactions on Components Packaging and Manufacturing Technology ·Xiangkun Yin, Zhangming Zhu, Yintang Yang, Ruixue Ding	2015	46
5	An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via IEEE Transactions on Electron Devices ·Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiangkun Yin, Xiaoxian Liu, Ruixue Ding	2014	42
6	Formic Acid-Assisted Synthesis of Palladium Nanocrystals and Their Electrocatalytic Properties Langmuir ·Qinchao Wang, Yiqian Wang, Peizhi Guo, Qun Li, Ruixue Ding, Baoyan Wang, Hongliang Li, Jingquan Liu, Xin Zhao	2013	41
7	Transport properties of boron-doped single-walled silicon carbide nanotubes Physica B Condensed Matter ·Yingying Yang, Ruixue Ding, Jiuxu Song	2010	37
8	A 1.4-mW 10-Bit 150-MS/s SAR ADC With Nonbinary Split Capacitive DAC in 65-nm CMOS IEEE Transactions on Circuits & Systems II Express Briefs ·Dengquan Li, Zhangming Zhu, Ruixue Ding, Yintang Yang	2017	36
9	A 10-Bit 600-MS/s Time-Interleaved SAR ADC With Interpolation-Based Timing Skew Calibration IEEE Transactions on Circuits & Systems II Express Briefs ·Dengquan Li, Zhangming Zhu, Ruixue Ding, Maliang Liu, Yintang Yang, Nan Sun	2018	34
10	Parasitic Inductance of Non-Uniform Through-Silicon Vias (TSVs) for Microwave Applications IEEE Microwave and Wireless Components Letters ·Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Ruixue Ding	2015	33
11	Modeling and Optimization of Multiground TSVs for Signals Shield in 3-D ICs IEEE Transactions on Electromagnetic Compatibility ·Chenbing Qu, Ruixue Ding, Xiaoxian Liu, Zhangming Zhu	2016	33
12	Effectiveness of <inline-formula> <tex-math notation="LaTeX">$p +$</tex-math> </inline-formula> Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications IEEE Microwave and Wireless Components Letters ·Xiangkun Yin, Zhangming Zhu, Yintang Yang, Ruixue Ding	2016	32
13	Synthesis of Palladium Colloidal Nanocrystal Clusters and Their Enhanced Electrocatalytic Properties ChemElectroChem ·Ruixue Ding, Xinyan Wu, Guangting Han, Qinchao Wang, Hailong Lu, Hongliang Li, Aiping Fu, Peizhi Guo	2014	22
14	A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications IEEE Microwave and Wireless Components Letters ·Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Ruixue Ding	2015	21
15	Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array IEEE Microwave and Wireless Components Letters ·Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Ruixue Ding, Yuejin Li	2017	20
16	An 8-Bit 2.1-mW 350-MS/s SAR ADC With 1.5 b/cycle Redundancy in 65-nm CMOS IEEE Transactions on Circuits & Systems II Express Briefs ·Dengquan Li, Maliang Liu, Lei Zhao, Henghui Mao, Ruixue Ding, Zhangming Zhu	2020	19
17	High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects IEEE Transactions on Components Packaging and Manufacturing Technology ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding, Yuejin Li	2017	19
18	Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs IEEE Microwave and Wireless Components Letters ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding	2014	18
19	Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias IEEE Transactions on Nanotechnology ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding, Yuejin Li	2017	18
20	Analysis of propagation delay and repeater insertion in single-walled carbon nanotube bundle interconnects Microelectronics Journal ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding	2016	17

About Ruixue Ding

Ruixue Ding is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Atomic and Molecular Physics, and Optics and Computer Networks and Communications, having authored 123 papers that have together received 1.1k indexed citations. Recurring topics across this work include Analog and Mixed-Signal Circuit Design (69 papers), Advancements in Semiconductor Devices and Circuit Design (36 papers), CCD and CMOS Imaging Sensors (36 papers), 3D IC and TSV technologies (27 papers), Advancements in PLL and VCO Technologies (24 papers), Radio Frequency Integrated Circuit Design (18 papers), Semiconductor materials and devices (14 papers) and Electromagnetic Compatibility and Noise Suppression (14 papers). The work is most often cited by research in Electrical and Electronic Engineering (945 citations), Biomedical Engineering (439 citations), Automotive Engineering (54 citations), Hardware and Architecture (25 citations) and Materials Chemistry (134 citations). Ruixue Ding has collaborated with scholars based in China, United States and Portugal. Frequent co-authors include Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Yintang Yang, Qijun Lu, Shubin Liu, Maliang Liu, Yuhua Liang, Xiangkun Yin and Dengquan Li. Their work appears in journals such as Analog Integrated Circuits and Signal Processing, IEEE Microwave and Wireless Components Letters, IEEE Transactions on Circuits & Systems II Express Briefs, IEEE Transactions on Circuits and Systems I Regular Papers and IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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