R.C. Blish
About
R.C. Blish has authored 19 papers that have received a total of 205 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Microstructure and mechanical properties (5 papers) and Metal and Thin Film Mechanics (3 papers). R.C. Blish is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Microstructure and mechanical properties (5 papers) and Metal and Thin Film Mechanics (3 papers) and collaborates with scholars based in United States, Canada and United Kingdom. R.C. Blish's co-authors include T. Vreeland, Susan Li, Hiroyuki Kinoshita, Heng Yao and A. Marathe and has published in prestigious journals such as Journal of Applied Physics and Microelectronics Reliability.
In The Last Decade
Fields of papers published by R.C. Blish
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by R.C. Blish
Since SpecializationCitations
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