Nick Simpson
Impact in
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- Magnetic Properties and Applications
- Mechanical Engineering top 5%
- Induction Heating and Inverter Technology
- Additive Manufacturing Materials and Processes
- Heat Transfer and Optimization
Papers in
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- Electric Motor Design and Analysis 40
- Silicon Carbide Semiconductor Technologies 13
- Electromagnetic Compatibility and Noise Suppression 10
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- Induction Heating and Inverter Technology 18
- Heat Transfer and Optimization 7
- Co-authors
- Phil Mellor (51 shared papers)Rafał Wróbel (16 shared papers)Antonio Griffo (1 shared paper)Christopher J. Tighe (1 shared paper)James Goss (2 shared papers)Sabrina Ayat (2 shared papers)Dave Staton (2 shared papers)Arun Arjunan (2 shared papers)
- Journals
- IEEE Transactions on Industry Applications (6 papers)Microelectronics Reliability (3 papers)IEEE Transactions on Magnetics (2 papers)IEEE Transactions on Plasma Science (1 paper)IEEE Transactions on Industrial Electronics (1 paper)
- Partner nations
- United KingdomGermanyChina
In The Last Decade
Nick Simpson
57 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 452
- Mechanical Engineering 729
- Electrical and Electronic Engineering 961
- Automotive Engineering 177
- Control and Systems Engineering 331
Countries citing papers authored by Nick Simpson
This map shows the geographic impact of Nick Simpson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nick Simpson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nick Simpson more than expected).
Fields of papers citing papers by Nick Simpson
This network shows the impact of papers produced by Nick Simpson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nick Simpson. The network helps show where Nick Simpson may publish in the future.
Co-authors
The 25 scholars most cited alongside Nick Simpson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 62 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 258 | |
| 2 | 2013 | 120 | |
| 3 | 2014 | 93 | |
| 4 | 2020 | 93 | |
| 5 | 2014 | 48 | |
| 6 | 2018 | 36 | |
| 7 | 2014 | 36 | |
| 8 | 2017 | 34 | |
| 9 | 2016 | 31 | |
| 10 | 2022 | 26 | |
| 11 | 2021 | 26 | |
| 12 | 2015 | 25 | |
| 13 | 2019 | 25 | |
| 14 | 2020 | 24 | |
| 15 | 2014 | 24 | |
| 16 | 2022 | 22 | |
| 17 | XXth International Conference on Electrical Machines (ICEM 2012) | 2012 | 21 |
| 18 | 2016 | 16 | |
| 19 | 2023 | 12 | |
| 20 | 2023 | 12 |
About Nick Simpson
Nick Simpson is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Control and Systems Engineering and Automotive Engineering, having authored 62 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electric Motor Design and Analysis (40 papers), Induction Heating and Inverter Technology (18 papers), Magnetic Properties and Applications (16 papers), Silicon Carbide Semiconductor Technologies (13 papers), Magnetic Bearings and Levitation Dynamics (10 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Additive Manufacturing and 3D Printing Technologies (9 papers) and Heat Transfer and Optimization (7 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (452 citations), Mechanical Engineering (729 citations), Electrical and Electronic Engineering (961 citations), Automotive Engineering (177 citations) and Control and Systems Engineering (331 citations). Nick Simpson has collaborated with scholars based in United Kingdom, Germany and China. Frequent co-authors include Phil Mellor, Rafał Wróbel, Antonio Griffo, Christopher J. Tighe, James Goss, Sabrina Ayat, Dave Staton, Arun Arjunan, John Robinson and J.D. Booker. Their work appears in journals such as IEEE Transactions on Industry Applications, Microelectronics Reliability, IEEE Transactions on Magnetics, IEEE Transactions on Plasma Science and IEEE Transactions on Industrial Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.