Moritz Andreas Meyer

7 papers and 185 indexed citations i.

Moritz Andreas Meyer has authored 7 papers that have received a total of 185 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 1 paper in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (6 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and devices (6 papers). Moritz Andreas Meyer is often cited by papers focused on Copper Interconnects and Reliability (6 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and devices (6 papers) and collaborates with scholars based in United States, Germany and Singapore. Moritz Andreas Meyer's co-authors include Ehrenfried Zschech, A. V. Vairagar, Paul S. Ho, Meike Hauschildt and Dieter Schmeißer and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Device and Materials Reliability and npj 2D Materials and Applications.