Moises Cases
Impact in
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Low-power high-performance VLSI design
- Advancements in PLL and VCO Technologies
- Electronic Packaging and Soldering Technologies
- Microwave Engineering and Waveguides
- Electrostatic Discharge in Electronics
Papers in
-
- VLSI and Analog Circuit Testing 9
-
- Electromagnetic Compatibility and Noise Suppression 46
- 3D IC and TSV technologies 18
- Low-power high-performance VLSI design 16
- VLSI and FPGA Design Techniques 10
- Advancements in PLL and VCO Technologies 9
- Electrostatic Discharge in Electronics 7
- Semiconductor Lasers and Optical Devices 6
- Co-authors
- N. Pham (44 shared papers)Damian Quinn (1 shared paper)Madhavan Swaminathan (10 shared papers)Bhyrav Mutnury (23 shared papers)Gareth Hougham (1 shared paper)David J. Russell (1 shared paper)Krishna Bharath (1 shared paper)Arif Ege Engin (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)IBM Journal of Research and Development (1 paper)IEEE Transactions on Circuits and Systems (1 paper)IEEE MTT-S International Microwave Symposium Digest, 2005. (1 paper)Electrical Performance of Electronic Packaging (7 papers)
- Partner nations
- United States
In The Last Decade
Moises Cases
60 papers receiving 360 citations
Peers
Comparison fields: 5 of 36
- Hardware and Architecture 49
- Electrical and Electronic Engineering 352
- Aerospace Engineering 48
- Statistics, Probability and Uncertainty 13
- Astronomy and Astrophysics 22
Countries citing papers authored by Moises Cases
This map shows the geographic impact of Moises Cases's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Moises Cases with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Moises Cases more than expected).
Fields of papers citing papers by Moises Cases
This network shows the impact of papers produced by Moises Cases. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Moises Cases. The network helps show where Moises Cases may publish in the future.
Co-authors
The 25 scholars most cited alongside Moises Cases, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 62 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 60 | |
| 2 | 1980 | 47 | |
| 3 | 2005 | 43 | |
| 4 | 2006 | 34 | |
| 5 | 2002 | 12 | |
| 6 | 2006 | 11 | |
| 7 | 2003 | 11 | |
| 8 | 2005 | 10 | |
| 9 | 2006 | 9 | |
| 10 | 2007 | 9 | |
| 11 | 2006 | 8 | |
| 12 | 2003 | 8 | |
| 13 | 2006 | 7 | |
| 14 | 2007 | 6 | |
| 15 | 2007 | 5 | |
| 16 | 2008 | 5 | |
| 17 | 2006 | 4 | |
| 18 | 2006 | 4 | |
| 19 | 2002 | 4 | |
| 20 | 2003 | 4 |
About Moises Cases
Moises Cases is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Control and Systems Engineering, Computer Networks and Communications and Biomedical Engineering, having authored 62 papers that have together received 385 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (46 papers), 3D IC and TSV technologies (18 papers), Low-power high-performance VLSI design (16 papers), VLSI and FPGA Design Techniques (10 papers), VLSI and Analog Circuit Testing (9 papers), Advancements in PLL and VCO Technologies (9 papers), Electrostatic Discharge in Electronics (7 papers) and Semiconductor Lasers and Optical Devices (6 papers). The work is most often cited by research in Hardware and Architecture (49 citations), Electrical and Electronic Engineering (352 citations), Aerospace Engineering (48 citations), Statistics, Probability and Uncertainty (13 citations) and Astronomy and Astrophysics (22 citations). Moises Cases has collaborated with scholars based in United States. Frequent co-authors include N. Pham, Damian Quinn, Madhavan Swaminathan, Bhyrav Mutnury, Gareth Hougham, David J. Russell, Krishna Bharath, Arif Ege Engin, Jamil A. Wakil and H. Smith. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Circuits and Systems, IEEE MTT-S International Microwave Symposium Digest, 2005. and Electrical Performance of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.