Ming-Che Hsieh

20 papers and 126 indexed citations i.

Ming-Che Hsieh is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Human-Computer Interaction. According to data from OpenAlex, Ming-Che Hsieh has authored 20 papers receiving a total of 126 indexed citations (citations by other indexed papers that have themselves been cited), including 13 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 3 papers in Human-Computer Interaction. Recurrent topics in Ming-Che Hsieh’s work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). Ming-Che Hsieh is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Integrated Circuits and Semiconductor Failure Analysis (3 papers). Ming-Che Hsieh collaborates with scholars based in Taiwan and China. Ming-Che Hsieh's co-authors include Ching‐Hsing Luo, Kuo‐Ning Chiang, Jen‐Her Wu, An-Bang Wang and Song Zhang and has published in prestigious journals such as Lab on a Chip, Information Processing & Management and Microelectronic Engineering.