Michael Toepper

9 papers and 139 indexed citations i.

Michael Toepper has authored 9 papers that have received a total of 139 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 3 papers in Cellular and Molecular Neuroscience and 1 paper in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Neuroscience and Neural Engineering (3 papers). Michael Toepper is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Neuroscience and Neural Engineering (3 papers) and collaborates with scholars based in Germany, United States and France. Michael Toepper's co-authors include M. Klein, Hermann Oppermann, Prashant Tathireddy, Sohee Kim and Florian Solzbacher and has published in prestigious journals such as Sensors and Actuators A Physical and Biomedical Microdevices.