Michael J. Bozack
About
Michael J. Bozack has authored 91 papers that have received a total of 2.2k indexed citations.
This includes 54 papers in Electrical and Electronic Engineering, 24 papers in Materials Chemistry and 22 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Semiconductor materials and devices (14 papers) and 3D IC and TSV technologies (13 papers). Michael J. Bozack is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Semiconductor materials and devices (14 papers) and 3D IC and TSV technologies (13 papers) and collaborates with scholars based in United States, China and Egypt. Michael J. Bozack's co-authors include John R. Williams, W. J. Choyke, Jeffrey C. Suhling, Minseo Park and John L. Evans and has published in prestigious journals such as Journal of the American Chemical Society, The Journal of Chemical Physics and Applied Physics Letters.
In The Last Decade
Fields of papers published by Michael J. Bozack
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Michael J. Bozack
Since SpecializationCitations
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