Lei Liu

165 papers and 3.6k indexed citations i.

About

Lei Liu has authored 165 papers that have received a total of 3.6k indexed citations. This includes 59 papers in Electrical and Electronic Engineering, 52 papers in Biomedical Engineering and 42 papers in Mechanical Engineering. The topics of these papers are Advanced Sensor and Energy Harvesting Materials (33 papers), Electronic Packaging and Soldering Technologies (17 papers) and 3D IC and TSV technologies (13 papers). Lei Liu is often cited by papers focused on Advanced Sensor and Energy Harvesting Materials (33 papers), Electronic Packaging and Soldering Technologies (17 papers) and 3D IC and TSV technologies (13 papers) and collaborates with scholars based in China, Canada and United States. Lei Liu's co-authors include Guisheng Zou, Y. Zhou, Wengan Wang, Bin Feng and Daozhi Shen and has published in prestigious journals such as Advanced Materials, Journal of Neuroscience and Applied Physics Letters.

In The Last Decade

Fields of papers published by Lei Liu

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Lei Liu

Since Specialization
Citations
Rankless by CCL
2025