Kripesh Vaidyanathan

17 papers and 320 indexed citations i.

Kripesh Vaidyanathan has authored 17 papers that have received a total of 320 indexed citations. This includes 11 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). Kripesh Vaidyanathan is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers) and collaborates with scholars based in Singapore, United States and Taiwan. Kripesh Vaidyanathan's co-authors include John H. Lau, Xiaowu Zhang, Dong Kyun Sohn, A.A.O. Tay and David Yeo and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Materials Science and Engineering A.