Junyong Park
About
Junyong Park has authored 38 papers that have received a total of 549 indexed citations.
This includes 32 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 5 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (13 papers), Electromagnetic Compatibility and Noise Suppression (12 papers) and Electronic Packaging and Soldering Technologies (6 papers). Junyong Park is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electromagnetic Compatibility and Noise Suppression (12 papers) and Electronic Packaging and Soldering Technologies (6 papers) and collaborates with scholars based in South Korea, United States and Japan. Junyong Park's co-authors include Joungho Kim, Youngwoo Kim, Kyungjun Cho, Seongsoo Lee and Subin Kim and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Power Sources and Chemical Engineering Journal
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