Jun Wei
Impact in
- Automotive Engineering top 0.1%
- Additive Manufacturing and 3D Printing Technologies
- Mechanical Engineering top 0.05%
- Additive Manufacturing Materials and Processes
- Aluminum Alloys Composites Properties
- High Entropy Alloys Studies
Papers in
-
- Electronic Packaging and Soldering Technologies 81
- 3D IC and TSV technologies 61
- Semiconductor materials and devices 22
-
- Aluminum Alloys Composites Properties 55
- Additive Manufacturing Materials and Processes 51
- Welding Techniques and Residual Stresses 20
- Co-authors
- Mui Ling Sharon Nai (68 shared papers)Kun Zhou (16 shared papers)Yuan Chen (9 shared papers)Shaobin Liu (3 shared papers)Rongrong Jiang (3 shared papers)Tingying Helen Zeng (2 shared papers)Jing Kong (2 shared papers)Renbing Wu (9 shared papers)
- Journals
- Thin Solid Films (11 papers)Materials Science and Engineering A (10 papers)Materials & Design (9 papers)Journal of Electronic Materials (8 papers)Journal of Alloys and Compounds (7 papers)
- Partner nations
- SingaporeChinaUnited Kingdom
In The Last Decade
Jun Wei
328 papers receiving 18.8k citations
Jun Wei's Hit Papers
Peers
Comparison fields: 5 of 167
- Automotive Engineering 3.6k
- Mechanical Engineering 7.9k
- Materials Chemistry 7.0k
- Biomedical Engineering 5.5k
- Electronic, Optical and Magnetic Materials 2.0k
Countries citing papers authored by Jun Wei
This map shows the geographic impact of Jun Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jun Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jun Wei more than expected).
Fields of papers citing papers by Jun Wei
This network shows the impact of papers produced by Jun Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jun Wei. The network helps show where Jun Wei may publish in the future.
Co-authors
The 25 scholars most cited alongside Jun Wei, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 340 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Antibacterial Activity of Graphite, Graphite Oxide, Graphene Oxide, and Reduced Graphene Oxide: Membrane and Oxidative Stress Hit paper breakdown → | 2011 | 2603 |
| 2 | Reduced Graphene Oxide Conjugated Cu2O Nanowire Mesocrystals for High-Performance NO2 Gas Sensor Hit paper breakdown → | 2012 | 708 |
| 3 | In‐Situ Formation of Hollow Hybrids Composed of Cobalt Sulfides Embedded within Porous Carbon Polyhedra/Carbon Nanotubes for High‐Performance Lithium‐Ion Batteries Hit paper breakdown → | 2015 | 644 |
| 4 | Hierarchical microstructure and strengthening mechanisms of a CoCrFeNiMn high entropy alloy additively manufactured by selective laser melting Hit paper breakdown → | 2018 | 548 |
| 5 | Lateral Dimension-Dependent Antibacterial Activity of Graphene Oxide Sheets Hit paper breakdown → | 2012 | 530 |
| 6 | Recent progress in synthesis, properties and potential applications of SiC nanomaterials Hit paper breakdown → | 2015 | 497 |
| 7 | Zeolitic Imidazolate Framework 67‐Derived High Symmetric Porous Co3O4 Hollow Dodecahedra with Highly Enhanced Lithium Storage Capability Hit paper breakdown → | 2014 | 467 |
| 8 | 2014 | 402 | |
| 9 | 2013 | 367 | |
| 10 | Friction stir welding of dissimilar materials between AA6061 and AA7075 Al alloys effects of process parameters Hit paper breakdown → | 2013 | 308 |
| 11 | 2017 | 293 | |
| 12 | 2005 | 248 | |
| 13 | 2019 | 222 | |
| 14 | 2018 | 208 | |
| 15 | 2019 | 192 | |
| 16 | 2007 | 189 | |
| 17 | 2012 | 188 | |
| 18 | 2016 | 184 | |
| 19 | 2017 | 184 | |
| 20 | 2017 | 179 |
About Jun Wei
Jun Wei is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Automotive Engineering and Biomedical Engineering, having authored 340 papers that have together received 19.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (81 papers), Additive Manufacturing and 3D Printing Technologies (63 papers), 3D IC and TSV technologies (61 papers), Aluminum Alloys Composites Properties (55 papers), Additive Manufacturing Materials and Processes (51 papers), Carbon Nanotubes in Composites (25 papers), Semiconductor materials and devices (22 papers) and Welding Techniques and Residual Stresses (20 papers). The work is most often cited by research in Automotive Engineering (3.6k citations), Mechanical Engineering (7.9k citations), Materials Chemistry (7.0k citations), Biomedical Engineering (5.5k citations) and Electronic, Optical and Magnetic Materials (2.0k citations). Jun Wei has collaborated with scholars based in Singapore, China and United Kingdom. Frequent co-authors include Mui Ling Sharon Nai, Kun Zhou, Yuan Chen, Shaobin Liu, Rongrong Jiang, Tingying Helen Zeng, Jing Kong, Renbing Wu, Mario Hofmann and Manoj Gupta. Their work appears in journals such as Thin Solid Films, Materials Science and Engineering A, Materials & Design, Journal of Electronic Materials and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.