John Persic

27 papers and 340 indexed citations i.

About

John Persic has authored 27 papers that have received a total of 340 indexed citations. This includes 23 papers in Electrical and Electronic Engineering, 9 papers in Mechanics of Materials and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Adhesion, Friction, and Surface Interactions (4 papers). John Persic is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Adhesion, Friction, and Surface Interactions (4 papers) and collaborates with scholars based in Canada, China and Vietnam. John Persic's co-authors include Y. Zhou, M. Mayer, Anming Hu, J.T. Moon and John Z. Wen and has published in prestigious journals such as Chemical Physics Letters, Review of Scientific Instruments and Journal of Physics and Chemistry of Solids.

In The Last Decade

Fields of papers published by John Persic

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by John Persic

Since Specialization
Citations
Rankless by CCL
2025